Leading Pastes for Dispensing / Jetting

  • Repeatable high frequency  micro deposits 
  • Highly consistent dispense volumes
  • Ultra-fine feature accuracy
PRODUCT NAME DESCRIPTION KEY FEATURES
ALPHA JP-500 Solder Paste A lead-free, zero halogen, no-clean solder paste designed for use in Jet Printers and approved for use with leading jetting equipment manufacturers.
  • Deposit capability and processability of circular dimensions down to 0.25mm (0.010”)
  • Excellent deposit consistency with high process capability index across all board designs
  • Reduction in random solderballing levels, increasing first time yield
ALPHA JP-501 Solder Paste A low temperature, lead-free, no-clean solder paste designed for use in Jet Printers.
  • Low temperature reflow profiles enables the use of low Tg PCB
  • Excellent deposit consistency with high process capability index across all board designs
  • Reduction in random solderballing levels

ALPHA OM-340 Solder Paste

 A lead-free, high reliability alloy, no-clean solder paste designed for a broad range of applications.
  • Maximizes reflow yield for lead-free processing
  • Reduction in random solderballing levels

 

We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.

Dispensing / Jetting Selective Soldering Gluing, Underfilling and Edgebonding Manual Soldering and Rework Robotic Soldering

We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.

Dispensing / Jetting Selective Soldering Gluing, Underfilling and Edgebonding Manual Soldering and Rework Robotic Soldering

As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.

Fine feature enabling Solder Pastes Low Temperature Solder Pastes Regulatory Compliance & Corporate Sustainability

As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.

Fine feature enabling Solder Pastes Low Temperature Solder Pastes Regulatory Compliance & Corporate Sustainability

We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.

Dispensing / Jetting Selective Soldering Gluing, Underfilling and Edgebonding Manual Soldering and Rework Robotic Soldering

We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.

Dispensing / Jetting Selective Soldering Gluing, Underfilling and Edgebonding Manual Soldering and Rework Robotic Soldering

As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.

Fine feature enabling Solder Pastes Low Temperature Solder Pastes Regulatory Compliance & Corporate Sustainability

As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.

Fine feature enabling Solder Pastes Low Temperature Solder Pastes Regulatory Compliance & Corporate Sustainability
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