Lead Pastes for Printing

  • High print speeds
  • Harsh manufacturing conditions
  • Fine feature printability
  • High Cp / CpK print deposit volume
PRODUCT Name DESCRIPTION KEY FEATURES
ALPHA OM-565 HRL3 Solder Paste Enables 175 °C peak reflow temperature to enhance mechanical reliability while improving energy efficiency of assembly process. 
  • Superior Non-Wet-Open and Head-in-Pillow performance
  • Enhanced mechanical reliability 
  • Compatible with contact rework applications

ALPHA OM-550 Solder Paste          

Designed to offer improved drop shock and thermal cycling performance versus existing low temperature alloys.
  • Fine Feature Capable
  • Post-reflow residue containment
  • Low Head in Pillow & Non-Wet Open
  • Ultra Low Voiding
  • Wide reflow process window

ALPHA CVP-390V Solder Paste            

A lead-free no-clean solder paste designed to maximize flexibility in manufacturing and provide superior electrochemical reliability in the most challenging applications. 
  • Fine Feature Capable
  • Post-reflow residue containment
  • Low Head in Pillow & Non-Wet Open
  • Pin in Paste Applications
  • Electronically reliable under hard conditions
  • Wide reflow process window

ALPHA OM-353 Solder Paste           

Lead-Free, zero halogen solder paste designed for broad latitude, high reliability applications, requiring process flexibility and residue containment.
  • Fine Feature Capable
  • Pin in Paste Applications
  • Electronically reliable on high density assemblies
  • Electrochemically reliable under hard conditions
  • Wide reflow process window
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