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ALPHA Argomax 功率电子 宣传册 简体中文

经过工程化精心设计的烧结材料和独特的工艺,为功率电子实践所有可能的设计。

ALPHA CVP-390 Solder Paste Flyer English

A lead-free, zero-halogen, no-clean, multi-alloy capable solder paste designed for high reliability applications where electrochemical reliability and excellent pin testability is required.  

Alpha CVP-390 Solder Paste Flyer Spanish

Una soldadura en pasta que no necesita limpiarse, sin plomo y con cero halógenos que además es compatible con diversas aleaciones y está diseñada para aplicaciones de alta confiabilidad, donde se requiere de confiabilidad electroquímica y excelente capacidad para las pruebas de pines. 

ALPHA CVP-390V Solder Paste Flyer English

A lead-free, zero-halogen, no-clean solder paste designed to provide advanced electrochemical reliability in harsh operating conditions on fine pitched component packages.

ALPHA CVP-390V锡膏 宣传页 简体中文

一款无铅、免清洗 、 完全不含卤素锡膏,旨在恶劣的工作条件下并在细间距组件上实现的电化学可靠性。

ALPHA CVP-390锡膏 宣传页 简体中文

一款无铅、完全不含卤素、免清洗焊膏。专为需要高电化学可靠性和针测性能的高可靠性应用而设计。 

ALPHA EF-2100 Liquid Flux Flyer English

The highest activity of any VOC-free Bellcore SIR compliant flux for defect-free soldering.

ALPHA EF-2100助焊剂 宣传页 简体中文

在所有能满足Bellcore表面绝缘阻抗(SIR)和无有机挥发物要求的助焊剂当中,ALPHA EF-2100具备最高活性,能实现无缺陷焊接。

ALPHA EF-6000 Liquid Flux Flyer English

An active, rosin-free, low solid, low residue liquid flux, specifically developed to deliver outstanding board cosmetics and to eliminate the tendency for solder balling and solder bridging, which are normally associated with rosin-free chemistries.

ALPHA EF-6000 Liquid Soldering Flux English

A no-clean flux for lead-free & Sn-Pb wave soldering specifically developed to deliver outstanding board cosmetics and to eliminate the tendency for solder balling and solder bridging, two types of defects which are normally associated with the use of the chip wave.

ALPHA EF-6808HF Kester 985M Flyer English

Halide free, low solids, alcohol based, no-clean wave soldering fluxes. 

ALPHA EF-8800HF Kester NF372-TB Flyer English

Alcohol-based fluxes designed for both standard and thicker, high-density PCBs in Lead-free processes.

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