Explore Flyers Documents

ALPHA HiTech Edgebond Flyer English

A one component, heat curable material.

ALPHA HiTech Encapsulants Flyer English

One component, intermediate temperature, fast heat curable materials which are designed to mechanically protect assembled chips and encapsulated IC devices from dropping off or cracking.

ALPHA HiTech Underfills Flyer English

Epoxy based materials to be dispensed on the edges of the BGA, CSP or Flip Chip devices.

ALPHA HiTech 粘合材料 宣传册 简体中文
  • 粘合剂
  • 底部填充剂
  • 边缘粘结剂
  • 密封剂
ALPHA HiTech密封剂 宣传页 简体中文

一种单组分、中温、快速可热固化的材料，旨在为组装的芯片和封装的IC器件提供机械保护，防止脱落或破裂。

ALPHA HiTech底部填充剂 宣传页 简体中文

基于环氧树脂的材料，用于 BGA、CSP 或倒装芯片器件边缘的涂覆。

ALPHA HiTech粘合剂 宣传页 简体中文

应用范围广，涵盖各种元件及工艺条件。

ALPHA HiTech边缘粘结剂 宣传页 简体中文

一种单组份、可热固化材料。固化的填充剂有助于提高焊接组装部件的强度，因此可以通过跌落冲击、冲击弯曲和热循环（TCT）等可靠性测试。

ALPHA HRL3 Solid Solder Flyer English

Designed to enable low temperature processes in selective and dip soldering.

ALPHA OM-220 Solder Paste Flyer English

A new, ultra-low temperature solder paste paired with ALPHA ULT1 alloy intended for soldering temperature sensitive components and substrates.

ALPHA OM-220锡膏 宣传页 简体中文

一种新型超低温焊膏，与ALPHA ULT1合金配合使用，为温度敏感组件和基板进行焊接。

ALPHA OM-353 Solder Paste Flyer English

Designed to meet the growing demand for ultra fine feature applications and consistent print volume repeatability.

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