Technical Publications

Three page article discussing how the ultra-thin layer between 60Sn-40Pb and Ag can be identified using field emission scanning electron microscopy and energy dispersive spectroscopy and asses the effect of the manufacturing equipment on interconnection reliability.  Published 2017.

Six page article focusing on several process, design and materials selection considerations which control or potentially reduce voiding to meet industry and end-market acceptance criteria.

Conference paper investigating direct comparison of two different alloys assembled both using conventional reflow process and vacuum soldering. Very unexpected reliability results were observed, highlighting potentially unintended consequences associated with vacuum soldering and void-free assembly.  IPC APEX 2022.

PV module manufacturers increasingly require higher throughput production lines with higher degrees of automation and flexibility. Establishing an electrical connection between solar cells in a module not only defines the final shape and output power of the solar panel, depending on the strategy applied it but also strongly impacts yield and throughput of the entire module factory. This paper analyzes solder joints and factors affecting solder joints in high throughput manufacturing.

this book provides an introduction to the evolution of modern low-temperature soldering, illustrates the importance of chemistry when developing low-temperature solders, and discusses advanced and emerging applications where lower melting point alloys can provide unique assembly solutions.  2018, I-Connect007’s micro eBook.

Link HERE to download.

Nine page article presenting an adaptation of JESD51-1 to measuring sintered silver die attach material thermal conductivity in-situ as compared to SAC305 solder.  Published 2017.

Fifteen page article investigating the use and limitations of machine-placed solid solder preforms during the top-side SMT reflow process for PTH components.  From 2011 APEX Proceedings.