View Products in HiTech Adhesives and Encapsulants

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  • ALPHA® HiTech AD13-9692B Adhesive

    ALPHA HiTech AD13-9692B is a one-component, low temperature cure epoxy system.  It is suitable for bonding heat sensitive devices and is specially designed for camera module application.

    • Fast Cure at Low Temperature
    • Excellent Drop Shock for units bonded to LCP
    • Halogen Free
    • Complies with RoHS Directive 2011/65/EU
  • ALPHA® HiTech AD13-9521B Adhesive

    ALPHA HiTech AD13-9521B is a one-component low temperature cure epoxy system. It is suitable for bonding heat sensitive devices.

    • Low Viscosity
    • Excellent Penetration /Fast Flow
    • Halogen-free and complies with RoHS Directive 2015/863/EU
  • ALPHA® HiTech AD13-9620B Adhesive

    ALPHA HiTech AD13-9620B is a one-component, low temperature cure epoxy system. It is developed for the bonding of heat sensitive devices.

    • No Flow
    • Fast Cure at low temperature
    • Excellent Adhesion on Liquid Crystal Polymer (LCP) and metal substrates. It is also able to bond well on Nylon (PA9T) and Polycarbonate surfaces.
    • Excellent Drop Shock
    • Halogen-free and complies with RoHS Directive 2015/863/EU
  • ALPHA® HiTech AD43-9600W Adhesive

    ALPHA HiTech AD43-9600W is a one-component, low temperature cure epoxy system.  It is specially designed to bond the lens onto a PCB bar for BLU (Back Light Unit) application.

    • Excellent Adhesion on FR4 and PMMA lens
    • White appearance to avoid ‘flaring’ phenomena when LED is lighted up
    • Halogen-free
    • Complies with RoHS Directive 2015/863/EU
  • ALPHA® HiTech SM42-120P Adhesive

    ALPHA HiTech SM42-120P is a one component, fast curable surface mount adhesive, specially designed for screen printing. 

    • Rheology specially designed for high throughput printing process
    • Non-Sagging
    • Excellent adhesion on common PCB board materials
    • Excellent thermal resistance during wave soldering process
    • Halogen-free and complies with RoHS Directive 2015/863/EU
  • ALPHA® HiTech SM42-1311 Adhesive

    ALPHA HiTech SM42-1311 is a one component, fast curable surface mount adhesive designed for dispensing applications.  

    • Rheology specially designed for high throughput dispensing process
    • Excellent adhesion on common PCB board materials
    • Excellent thermal resistance during wave soldering process
    • Complies with RoHS Directive 2011/65/EU
    • Halogen-free
  • ALPHA® HiTech UP44-5566T Adhesive

    ALPHA HiTech UP44-5566T is a one-component UV cure system. It is suitable for fast curing and bonding in various applications such as coating and fixing of components.

    • Fast Cure under a UV Light Source
    • Excellent Adhesion
    • Halogen-free
    • Complies with RoHS Directive 2015/863/EU
  • ALPHA® HiTech EN31-4007B Encapsulant

    ALPHA HiTech EN31-4007B is a one-component epoxy system designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. 

    • Excellent Impact Bending
    • Excellent Drop Shock
    • Excellent Impact Resistance
    • Highly Reworkable
    • Possesses Waterproofing Property
    • Halogen-free and complies with RoHS Directive 2015/863/EU
  • ALPHA® HiTech EN21-4210F Encapsulant

    ALPHA HiTech EN21-4210F is a one-component epoxy system designed to encapsulate the chip component thus protecting the device and strengthening the solder joints. 

    • Excellent Adhesion Strength
    • Impart Waterproofing Property
    • Resists Migration in Flux Residue
    • Halogen-free & complies with RoHS Directive 2015/863/EU
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