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  • ALPHA® Argomax® 6500 Bond Pad

    SinteReady Bond Pad Supports Copper Wire bonding / Ribbon bonding

    • Hot tacking capable for assembly without glue dots
    • Target sinter bondline options of 12µm and 25µm
    • Customer defined dimensions, including foil thickness 
    • Fast hot tacking time for high throughput
    • Low sinter pressure, low sinter temperature
    • Tape and reel packaging
  • ALPHA® Argomax® 6100 Laminated Clips

    SinteReady Laminated Clip with ALPHA Argomax Film

    • SinteReady die top to substrate interconnect
    • Target bondline range of 10-50µm
    • Hot Tacking Capable based on ALPHA Argomax Film
    • Compatible with Ag, Au and Cu metallization surfaces
    • Low sinter pressure and low sinter temperature
    • Fast sinter time for high manufacturing throughput
    • Tape and reel packaging
  • ALPHA® Argomax® 9500 Sinter Preforms

    SinteReady Preforms for Copper Metallization Surfaces

    • Ready to sinter dry placement interconnect compatible with Copper metallization surfaces
    • Target total bondline range of 50-250µm​
    • Customer defined dimensions​
    • Low sinter pressure, low sinter temperature 
    • Fast sinter time for high yield manufacturing​
    • Tape and reel packaging
  • ALPHA® Argomax® 9200 Sinter Preforms

    SinteReady Preforms for Silver & Gold Metallization Surfaces

    • Ready to sinter dry placement interconnect compatible with Ag and Au metallization surfaces​
    • Target total bondline range of 50-250µm​
    • Customer defined dimensions​
    • Compatible with Ag and Au metallization surfaces​
    • Low sinter pressure, low sinter temperature
    • Fast sinter time for high yield manufacturing
    • Tape and reel packaging
  • ALPHA® Argomax® 8035 Film

    Sinter Silver Film for Die Attachment – Wafer Level Processing with Copper surface Die attach

    • Designed specifically for wafer dicing after lamination with dicing tape 
    • Formulated for Cu surface die attach
    • Film can be cut to custom sizes
    • Pure silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing 
    • Die attach temperatures suitable for semiconductor manufacturing 
       
  • ALPHA® Argomax® 8031 Film

    Sinter Silver Film for Die Attachment – Wafer Level Processing

    • Designed specifically for wafer dicing after lamination with dicing tape 
    • Formulated for Ag/Au surface die attach
    • Film can be cut to custom sizes
    • Pure silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing 
    • Die attach temperatures suitable for semiconductor manufacturing 
  • ALPHA® Argomax® 8021 Film

    Sinter Silver Film for Die Attachment

    • Die Transfer Film (DTF) process
    • Optimized for a wide range of surfaces
    • Customized for fast and easy die and clip lamination 
    • Pure silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing 
    • Die attach temperatures suitable for semiconductor manufacturing 
  • ALPHA® Argomax® 8020 Film

    Sinter Silver Film for Die Attachment

    • Die-Transfer-Film (DTF) process
    • Designed for Ag/Au surfaces
    • Customized for fast and easy die and spacer lamination 
    • Pure silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing 
    • Die attach temperatures suitable for semiconductor manufacturing 
       
  • ALPHA® Argomax® 8010 Film

    Sinter Silver Film for Large Area Lamination

    • Large area lamination film solution
    • Custom cut film sizes available
    • Pure Silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing 
  • ALPHA® Argomax® 5040 Paste

    Sinter Silver Paste for Die Attachment on Copper surface with Wet Die Placement 

    • Application: Die Attach, Die Top Attach
    • Formulated for printing or dot dispense on Cu surfaces
    • Designed for die placement on wet paste
    • Pure Silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing  
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