Product Overview

ALPHA Accuflux Preforms for power electronics are an ideal solution for applications that require low voiding in large area solder joints and a low flux residue.  

The flux application process for ALPHA Accuflux preforms is unique and guarantees each preform will have the same amount of flux within tightly controlled range.  The low flux weight required to yield good solder wetting results in significantly reduced voiding levels.  

Product Features

  • Various larger area preform sizes and thicknesses available
  • Fast placement using standard pick and place equipment
  • Non-tack flux formulation compatible with vacuum pick up systems
  • Available in standard alloys plus Innolot, Powerbond and high Pb alloys
  • Can be combined with ALPHA TrueHeight bondline control preforms  
  • EIA-481 tape and reel packaging
     

ALPHA Accuflux Flux Types and Applications for Power Electronics

chart of power electronics accuflux options

Related Products

PRODUCT TYPE

PRODUCT NAME

COMPATIBLE SURFACE FINISH

PRODUCT APPLICATION METHOD

END APPLICATION

Bond line Control Preforms

ALPHA TrueHeight Preforms

All solderable surfaces

Pick & Place

Clip Attach / Substrate Attach

Pb-free, High temp Alloy Preforms

ALPHA PowerBond Preforms

All solderable surfaces

Pick & Place

Substrate Attach / Other

Innolot Alloy Preforms

Innolot Preforms

All solderable surfaces

Pick & Place

Substrate Attach / Other
What do you need solved?
Let our experts find your solution.
Contact Us