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ALPHA TrueHeight Preforms contain embedded bondline control wires that maintain a minimum bondline of the solder joint after reflow, ensuring solder joint reliability.
Multiple bondline control mechanisms can be included in a single solder preform to prevent tilt while ensuring a minimum bondline for applications such as warped substrate soldering.
These preforms are available in a wide range of sizes, suitable for clip attach, as well as substrate and heat spreader attach applications.
- Bondline control for 75µm and larger thicknesses
- Ideal solution for clip attach and warped substrates
- Available in a wide variety of alloys, including PbSnAg, SnSb, SAC, Innolot, Powerbond, and others
- ALPHA TrueHeight Preforms can be provided with an optional external ALPHA Accuflux flux coating.
- Tape and reel packaging
TrueHeight Solder Preform Applications Die Attach / Clip Attach / Substrate Attach
Bond line control (BLC) preforms are used in die attach and die top clip attach to ensure uniform solder thickness for reliability.
Bond line control mechanism is capable of addressing complex warped substrate applications by strategically locating the BLC wires within the solder preform in precise locations to ensure minimum bondline, and prevent tilt.
Related Products
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Product Type |
Product Name |
Compatible Surface Finish |
Product Application Method |
End Application |
|---|---|---|---|---|
|
Flux Coated Preforms |
All solderable surfaces |
Pick & Place |
Substrate Attach / Other |
|
|
Innolot Alloy Preforms |
All solderable surfaces |
Pick & Place |
Substrate Attach / Other |
|
|
Lead-free, high temp. Alloy Preforms |
All solderable surfaces |
Pick & Place |
Substrate Attach / Other |
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