Soldering Alloys

• Low temperature enabling in selective and dip soldering processes.
• Provides efficiencies in energy savings and reduces thermal damage.
• Comparable hole fill performance and solder joint strength vs SAC305.
• Low Copper erosion vs SAC305.

• Best-in-class yield, out performing all Sn/Cu based materials
• Fast wetting providing excellent solderability
• Lower levels of bridging compared to Sn/Cu alloys
• Delivers excellent performance across a wide range of flux technologies
• High mechanical reliability

• SAC305-like performance
• Fast wetting and wide process window
• Strong, ductile joint for high mechanical reliability
• Lower material costs vs SAC305 
• Low dross rate
• Low copper dissolution

• Low Silver for lower material cost
• Low dross rate
• Low copper dissolution
• Excellent mechanical reliability
• Fast wetting and wide process window

• Reliability - comparable to silver bearing alloys and other enhanced alloys in thermal fatigue resistance and joint strength
• Lowers total cost of ownership due to lower material cost, high yields, and wide process window
• Excellent wetting performance and low defect rate
• Lowest-in-class dross generation
• Delivers good performance across different soldering processes

• Lowers total cost of ownership due to lower material cost, high yields and low copper dissolution rate
• Excellent solderability due to fast wetting speed, improves hole fill on multiple reflow boards
• Compatible with all assembly SAC based alloys
• Excellent shelf life

Proprietary processing prior to casting provides the following benefits:

• Removal of finely divided suspended oxides that are found in raw materials
• Increase in fluidity resulting in fewer soldering defects
• Reduced drossing rate provides a wave that stays cleaner, longer

• Increases production speed and yield
• Reduces icicling and bridging
• Reduces production costs
• Solders at lower temperatures
• Minimal dross formation

• Increases Production Speed
• Minimizes Drossing
• Reduces Bridging
• Solders Densely Populated Boards
• Solders at a Lower Temperature