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Low Temperature Processing
Many circuit board assemblers have found that low temperature solders offer substantial process, reliability and sustainability benefits by enabling lower peak reflow temperatures
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Reduced Voiding in Solder Joints
There is general consensus in the electronics assembly industry that solder joints with a low level of voids are more resistant to mechanical stress and more electrically and thermally conductive. Achieving low voiding in a solder joint requires the use of specially designed soldering materials in combination with carefully controlled process conditions. We have both the materials and process knowledge to help our customers minimize voiding.
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Enabling Electronics Miniaturization
As electronics increase in functionality, the circuit boards needed to deliver the user experience become more complex in design. Some of the variables to consider include: components, pitch, substrates, and a variety of processing techniques, such as, dispensing, jetting and selective soldering.
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Reliability in Harsh End-Use Environments
Product reliability is the most important factor to both the user and manufacturer of the final electronic device or equipment. The cost of poor product reliability is immeasurable. Electronic products have different electrochemical, mechanical and thermo-mechanical reliability requirements depending on their end use.
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Cost Effective Pb-Free Options
The electronics assembly industry strives to reduce manufacturing costs while maintaining product quality and reliability. We offer material options that can help lower total costs for assemblers making a wide variety of electronic products while optimizing reliability.
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Regulatory Compliance and Corporate Sustainability
Manufacturers of electronic products are becoming increasingly aware and concerned with the environmental and human health impact of the raw materials they use. Many companies have established policies and programs designed to reduce the number of potentially harmful substances in their products even beyond the legislative restrictions imposed on them. Material options that help meet their sustainability and compliance objectives are available.
Bondline Control
Solder joint reliability is a function of alloy, bondline thickness, operating temperature excursions, and vibration. Bondline thickness can play a critical role, impacting assembly yield, and ultimately define the solder joint reliability. By controlling the bondline thickness, the solder thermal impedance is controlled, and the reliability of the solder joint is predictable.
SiC Die Attach
SiC, the next generation Wide Band Gap (WBG) semiconductor material is the ideal material for high temperature power electronics (for automotive and space applications).
Thin Die Attach with Film
ALPHA Argomax films are enabled by proprietary nanoparticles. With film format, printing and drying steps are not needed and the format comes with in-built bond line and tilt control.
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