Solutions for Bondline Control - ALPHA TrueHeight Preforms

ALPHA TrueHeight Preforms contain embedded bondline control wires that control the minimum bondline of the solder joint after reflow. 

Multiple bondline control mechanisms can be included in a single solder preform to prevent tilt while ensuring a minimum bondline. 

These preforms are available in a wide range of sizes, suitable for die attach, die top attach, clip attach connections, as well as, warped substrate attach applications.

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ALPHA TrueHeight Solder Preform Power image

Products for Bondline Control

PRODUCT TYPE PRODUCT NAME COMPATIBLE SURFACE FINISH PRODUCT APPLICATION METHOD END APPLICATION
Bond line Control Preforms ALPHA TrueHeight Preforms All solderable surfaces Pick & Place Clip Attach / Substrate Attach

 

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