ALPHA TrueHeight Preforms contain embedded bondline control wires that control the minimum bondline of the solder joint after reflow.
Multiple bondline control mechanisms can be included in a single solder preform to prevent tilt while ensuring a minimum bondline.
These preforms are available in a wide range of sizes, suitable for die attach, die top attach, clip attach connections, as well as, warped substrate attach applications.
Products for Bondline Control
|PRODUCT TYPE||PRODUCT NAME||COMPATIBLE SURFACE FINISH||PRODUCT APPLICATION METHOD||END APPLICATION|
|Bond line Control Preforms||ALPHA TrueHeight Preforms||All solderable surfaces||Pick & Place||Clip Attach / Substrate Attach|