View Solutions in Reduced Voiding in Solder Joints
Low Voiding Solder Pastes
Our solder paste portfolio offers products that are designed to minimize void formation during the reflow process. Lower voids generally mean overall improved thermal conductivity and can enhance reliability.
Low Voiding Solder Preforms
Solder preforms can contribute greatly to the reduction of voids in a solder joint. Lower voids generally mean overall improved conductivity, thermal management and mechanical reliability.