High Reliability Solder Pastes

Our broad line of solder pastes include many that are designed for resistance to both thermo-mechanical fatigue and electrochemical migration.

Leading High Reliability Solder Pastes

PRODUCT NAME	DESCRIPTION	FEATURES
ALPHA CVP-390V Innolot	A lead-free, no-clean solder paste designed to maximize flexibility in manufacturing and provide superior electrochemical reliability in the most challenging applications.	Exceptional pin testability to ensure first pass yields Superior electrochemical performance on fine pitched components to ensure reliability on complex PCB assemblies Excellent coalescence down to 170 µm apertures on high density assemblies
ALPHA OM-353 Solder Paste	Lead-free, zero-halogen solder paste designed for broad latitude, high reliability applications, requiring process flexibility and residue containment.	Broad latitude paste with wide print process window on fine aperature sizes Excellent electrochemical reliability on fine pitched components in harsh operating conditions Superior post reflow residue containment
ALPHA OM-550 Solder Paste	ALPHA OM-550 is a zero halogen, low temperature chemistry paired with the HRL1 alloy designed to offer improved drop shock and thermal cycling performance versus existing low temperature alloys.	Low reflow peak temperature of 185 to 195 °C for mixed alloy process Compatible with HRL1 alloy for comparable mechanical performance to SAC305 in the right application Reduction of warpage induced defects compared to SAC reflow process

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