Explore Technical Publications Documents

Copper Plating Process for Filling Micro Vias and Through Via Holes with Minimum Surface Deposition

EIPC 2013

Cyanide-Free Immersion Gold Suitable for PCB Surface Finishing

SMTA International 2015

Direct Metallization System for Flexible Printed Circuit Board

SMTA International 2015

Effect of Chemical and Processing Parameters for Hole Filling Characteristics of Copper Electroplating

IPC APEX 2012

Effects of Adhesion Promotion Treatment on Electrical Signal Attenuation

SPP 2006

Electroless Nickel/Immersion Silver - A New Surface Finish for PCB Applications

SMTA International 2012

Electroplated Copper Filling of Through Holes Influence of Hole Geometry

SMTA International 2016

Electroplating Processes for IC Substrates - Embedded Trace Plate, Via Fill And Through Hole Fill

IMPACT 2018

Filling Characteristics of Process for Electroplating Copper into Microscopic Recessed Features

SMTA International 2012

Green Technology for the Plated Through Hole Process

IEEE 2013

High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Processes

IPC APEX 2017 English

High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Processes (Chinese)

China PCB007 2017

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