Product Overview

Whether you need durability, long lasting corrosion resistance, or functional final finishes, we have a wide range of chemical processes for finishing connectors and interconnects.

The MacDermid Enthone brand of connector finishing technology meets the demands for increasingly complex shapes, finer features, and greater reliability. Through reduced consumption, greater metal selectivity, and increased productivity, every process is designed with the lowest cost of ownership in mind.

Product Features
  • Pre-treatments: specially formulated cleaners and activators for a wide range of substrate metals.
  • Base metals: matte and bright coppers, nickels, and nickel alloys that provide a robust foundation for long-term adhesion and reliability.
  • Tin: bright and matte deposits that are highly solderable and have excellent whisker resistance.

Whether you need durability, long lasting corrosion resistance, or functional final finishes, we have a wide range of chemical processes for finishing connectors and interconnects.

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 Documentation icon - Flyer
EVABRITE® WS1 / WS1-E Sales Sheet (EN)
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 Documentation icon - Flyer
M-Contact IN-2000 Sales Sheet (EN)
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 Documentation icon - Technical Publication
Controlling Copper Roughness to Enhance Surface Finish Performance Technical Publication SMTAI 2015 (EN)
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 Documentation icon - Technical Publication
Investigating and Characterizing Reduced Whisker Growth from a Bright Pure Tin Process Technical Publication INEMI 2015 (EN)
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 Documentation icon - Technical Publication
Measuring Copper Surface Roughness for High Speed Applications Technical Publication APEX 2015 (EN)
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Connectors and Interconnect
Pre-Treatment

Cleaner and Degreasers
Alkaline electrocleaner for steel and copper

Activators
Fluoride containing acid salt for activation of copper, copper alloys, and steel 

Copper

Bright, Matte
High speed plating for mid to high current densities, available in either sulfuric acid or MSA solutions.

Strike
Cyanide-based copper strike.

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CS-T9-Connector-Interconnect-2
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Close-up of HDMI cord
Nickel/Nickel Alloys

Nickel-Tungsten Alloy
Sulfamate based nickel-tungsten (35-45 wt% W) deposit for improved wear and corrosion resistance. High speed / wide plating window allows tight control of alloy composition.

Nickel-Phosphorus Alloy
Sulfamate based nickel-phosphorous (3-12% wt% P) deposit for improved corrosion resistance and non-magnetic properties. High speed / wide plating window allows tight control of alloy composition.

Semi-Bright Matte Pure Nickel
Deposits a semi-bright, slightly tensile stressed, and ductile layer. Ideal undercoat for precious and non-precious metal deposits.

Palladium

Pure
Bright, ductile deposit for use in reel to reel or rack and barrel applications.

Palladium Alloy
“HS” - High Speed, “LS” - Low Speed, and reduced consumption options. Bright, ductile deposits, exceptional contact stability and wear resistance.

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Close-up of circuit board components
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Name CS-T9-Connector-Interconnect-5
Tin

Matte (MSA)
High speed, high efficiency, low foam electrolytes for deposition of pure tin over a wide current density range. Low stress deposits for whisker mitigation.

High efficiency, low speed, low foam electrolytes designed for rack and barrel deposition of pure tin. Light color and fine grain with a matte, uniform appearance.

Bright (MSA)
High speed, reel to reel or rack and barrel plating solutions with wide current density ranges. High brightness, low stress deposit with low carbon occlusion.

Indium

Acid
High speed, high efficiency, MSA based electrolyte. Long bath life, low maintenance, and simple bath control. Uniform plating at a wide current density range.

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Side by side comparison between Pure Tin Coating (on the left) and M-Contact IN-2000 Indium Coating (on the right)
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Gold circuit board components
Gold

Cobalt Alloy
Bright yellow deposit, low porosity, and high purity. Stable process with high efficiency and speed at high current densities; minimal over-plate at low current densities.

Nickel Alloy
Selective, high-speed, mirror-bright deposits. Consistent and uniform deposits over a wide range of current densities. Suitable for both reel to reel or rack and barrel applications.

Cobalt or Nickel
General purpose bath for both nickel and cobalt hardened applications.

Gold Strike
Mildly acidic gold strike for enhanced adhesion of subsequent plated deposits.

Silver

Low Speed
Low speed silver plating process for rack and barrel applications.

High Speed
High speed silver plating for reel to reel plating with inert anodes.

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Close-up of silver charging cord
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Post-Treatment

Silver Post Treatments
Electrolytic, high-speed, water-based organic solution.

Electrolytic, high speed, Pd base, high heat resistance.

Immersion solution, solvent-based organic solution.

Gold Post Treatments
Electrolytic, high-speed, water-based organic solution.

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