News & Events

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News_AS_OM372 Award_30Aug21
Assembly
Press Release
New Product Innovation Award for ALPHA OM-372 Solder Paste
MacDermid Alpha Electronics Solution was awarded the 2021 Circuits Assembly New Product Innovation Award for ALPHA OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.
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Three photos of new MacDermid Alpha Applications Lab in Taiwan, one of the building and two inside the lab
Semiconductor
Press Release
New Die Attach Applications Center Opens in Zhongli District, Taoyuan City, Taiwan R.O.C
(West Haven, Connecticut, USA) – MacDermid Alpha Electronics Solutions, a global leader in high performance electronics materials, officially opened a Greater China Die Attach Application Center on April 1st, 2021. The advanced technology and application center will house technical service and lab personnel, equipped with state-of-the-art die attach assembly and process equipment.
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News_iMAPS_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Supporting Partner at the Upcoming IMAPS Device Packaging Conference
MacDermid Alpha Electronics Solutions will be a Supporting Partner at the upcoming IMAPS Device Packaging Conference being held virtually from April 12-15, 2021. MacDermid Alpha will highlight their entire portfolio of technologies from their MacDermid Enthone, Alpha, Kester, and Compugraphics brands essential to advanced semiconductor packaging and the markets it enables.
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News_LOPEC 21_31Aug2021
Assembly
Press Release
Technical Presentation on Materials for 3D Structural Electronics at LOPEC 2021 Virtual Exhibition & Conference
MacDermid Alpha Electronics Solution will present “Next Generation Electronic Materials for Structural and 3D In-Mold Electronics” at LOPEC 2021 Virtual Exhibition and Conference on March 25, 2021.
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News_Deery Brook_2Sep2021
Assembly
Press Release
MacDermid Alpha Announces New Distribution Partnership for Hungary
The Assembly Division of MacDermid Alpha Electronics Solutions is excited to announce a new distribution partnership with Deery Brook for the sale and distribution of Alpha brand products in Hungary, effective March 16th, 2021.
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News_Alpha OM-220 Solder Paste_Product Release_2Sep2021
Assembly
Press Release
Product Launch - New Ultra-Low Temperature Solder Paste Capable of Soldering Heat-Sensitive Components
MacDermid Alpha Electronics Solutions announces the release of ALPHA OM-220, its latest innovation in low-temperature solder technology.
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News_Productronica_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Ultra-Fine Feature Solder Paste Introduced at Productronica China
The Assembly Solutions division will introduce ALPHA OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.
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News_APEX 2021_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Latest Interconnect Technologies Promoted and Microvia Reliability Presented at the 2021 Virtual IPC APEX Exhibition and Conference
MacDermid Alpha Electronics Solutions will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.
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News_STAYDRY H2-3000PSA_Product Release_2Sep2021
Semiconductor
Press Release
Product Launch - STAYDRY® H2-3000PSA: Hydrogen & Moisture Getter Film
MacDermid Alpha Electronics Solutions announces the release of STAYDRY® H2-3000PSA, a hydrogen and moisture getter for hermetic packages. STAYDRY H2-3000PSA adds a newly developed proprietary adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting Mil-STD-883K, Method 5011.6 and NASA ASTM E595 requirements.
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News_HiTech Cornerfill and Underfill_Product Release_2Sep2021
Assembly
Press Release
Product Launch - ALPHA HiTech High Tg, Low CTE Underfill & Cornerfill Bonding Materials
The Assembly Division announces the release of ALPHA HiTech Underfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
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News_Alpha OM-372_Product Release_2Sep2021
Assembly
Press Release
Product Launch - New Innovative Solder Paste Enabling Next Generation High Density Assembly Designs
MacDermid Alpha Electronics Solutions is pleased to launch ALPHA OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.
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News_IECE HKPCA 20_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Latest Technology Offerings Promoted at the International Electronics Circuit Exhibition
MacDermid Alpha Electronics Solutions will be exhibiting at the International Electronics Circuit Exhibition hosted by the Hong Kong Printed Circuit Association. The show will be held from December 2-4, 2020 at the Shenzhen Convention and Exhibition Center, China.
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