News & Events

Image
MacdermidAlpha-Market
Image
News_Systek ETS 1200_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - Systek ETS 1200 Pattern Plating Metallization for Embedded Trace Substrates
MacDermid Alpha Electronics Solutions announces the release of Systek ETS 1200, the latest addition to the Systek family of IC Substrate manufacturing solutions.
Image
News_SNEC 2020_2Sep2021
Assembly
Press Release
Technical Presentation on Advantages of Solder Paste in Shingling Interconnection at SNEC PV Power Expo China
The Assembly Division of MacDermid Alpha Electronics Solutions will present the technical paper “Advantages of Solder Paste in Shingling Interconnection” during the SNEC 14th (2020) International Photovoltaic (PV) Power Generation and Smart Energy Exhibition & Conference taking place from August 7-10 in Shanghai, China.
Image
News_Systek UVF 100_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - Systek UVF 100: 2 in 1 RDL Simultaneous Copper Via Filling and Fine Line Plating for IC Substrate Manufacturing
MacDermid Alpha Electronics Solutions announces the release of Systek UVF 100, the newest release in the Systek family of IC Substrate manufacturing solutions.
Image
News_Productronica_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
New Ultra-Low Temperature Solder and 5G Solutions Launching at Productronica China 2020
The Assembly Solutions Division of MacDermid Alpha Electronics Solutions will introduce its new ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.
Image
News_Automotive Electronics AS_Webinar_2Sep2021
Assembly
Press Release
MacDermid Alpha to Host Automotive Electronics Assembly Solutions Customer Webinar
The Assembly Solutions division of MacDermid Alpha Electronics Solutions is hosting a free, online customer webinar on the topic of Automotive Electronics Assembly Solutions. The webinar will take place on Wednesday 24th June at 15:00pm CET with Paul Salerno, Portfolio Manager – SMT as presenter.
Image
News_Systek SAP_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - Complete Semi-Additive Process for IC Substrates and Panel Level Packaging: Systek SAP
MacDermid Alpha Electronics Solutions announces the release of Systek SAP.
Image
News_SMT Global Packaging Panel_2Sep2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Technology Experts to Participate in Online Industry Panel Discussions
MacDermid Alpha Electronics Solutions will participate in two online panel discussions on Tuesday 2nd June; Recent Advances in Low Temperature Solders hosted by Global SMT & Packaging, and the SMT Printing Round Table hosted by the Surface Mount Technology Association (SMTA).
Image
News_Italian Customer_Webinar_2Sep2021
Assembly
Press Release
MacDermid Alpha to Host Series of Online Italian Customer Webinars
The Assembly Solutions Division is hosting a series of four free online webinars for Italian customers on key topics from Void Reduction to Low Temperature Assembly Solutions. The webinars will be hosted by MacDermid Alpha’s technology experts, in Italian language and will begin on Tuesday May 26th.
Image
ALPHA SnCX Plus
Assembly
Press Release
MacDermid Alpha Promotes ALPHA® SnCX Plus 07 Alloy as a New Solution for Moderately Complex Assemblies
The Assembly Solutions division promotes its ALPHA SnCX Plus 07 silver free and lead free wave solder alloy as a new solution for moderately complex assemblies.
Image
MAES
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
MacDermid Alpha Announces the Appointment of Rick Fricke as Vice President and General Manager of Semiconductor Solutions Division
MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces Rick Fricke will be joining MacDermid Alpha Electronic Solutions (MAES) as the Vice President and General Manager of their Semiconductor Solutions division.
Image
News_MacuSpec THF 100_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - Single Step Copper Through Hole Filling Process for Advanced PCBs: MacuSpec THF 100
MacDermid Alpha Electronics Solutions announces the release of MacuSpec THF 100, a single step copper through hole filling process that enables improved thermal and structural designs for IC substrates.
Image
News_SMTA Philly 20_31Aug2021
Assembly
Press Release
Research Presentation on High-Reliability Alloys at SMTA Philadelphia Chapter Meeting
Jason Fullerton will present at the SMTA Philadelphia Chapter meeting being held on March 12th, 2020 at Lutron Electronics, Inc. in Coopersburg, Pennsylvania.
What do you need solved?
Let our experts find your solution.