Latest Interconnect Technologies Promoted and Microvia Reliability Presented at the 2021 Virtual IPC APEX Exhibition and Conference

The Circuitry Solutions division will highlight the Affinity family of ENIG and ENEPIG final finishes, including their new reduction assisted gold plating process Affinity 3.0, as well as their complete line of leading-edge metallization processes for exceptionally reliable copper filled microvias. Additional details about the newly installed final finish pilot line at their Waterbury, CT Innovation Center and accompanying partnership initiative will be provided.

The newly released STAYDRY H2-3000PSA will be in the spotlight for the Semiconductor Solutions division. The film is a unique getter, which employs an active hydrogen getter and desiccant for water absorption, dispersed in a flexible silicone polymer matrix. The newly developed backing PSA (Pressure Sensitive Adhesive) offers customers easier attachment within a few seconds, eliminating the need for additional dispense adhesive process, time and equipment common with most materials.

The Assembly Solutions division will promote three of their latest solder paste innovations for ultra-fine feature, high reliability and low temperature applications. ALPHA OM-372, is an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components. Kester’s NP505-HR solder paste with the high reliability Innolot alloy was formulated specifically to provide enhanced thermomechanical performance in harsh operating conditions. For low temperature applications, ALPHA OM-220, enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components.

Three new ALPHA HiTech Underfill and Edgebond products featuring high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance will also be featured. ALPHA HiTech CU21-3240 and ALPHA HiTech CU31-2030 are one-component capillary underfills designed for the protection of assembled chip packages onto printed circuit boards, providing excellent reliability performance. ALPHA HiTech CF31-4010 is a one component, high filler content, heat curable edgebond that helps strengthen the soldered assembled component, allowing it to pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).

Bill Bowerman, Director Primary Metallization, will be presenting, “Process Improvement Strategies for Weak Microvia Interfaces.” The paper outlines MacDermid Alpha’s investigations into the industry concerns for microvia reliability in board designs with vias and microvias in stacked, staggered, and buried configurations. The all-inclusive approach taken by MacDermid Alpha while working directly with customers led to a catalogue of extensive studies examining the reliability of the microvia structure following via manufacturing from laser formation, hole cleaning, target pad preparation and primary to electrolytic metallization. To learn more about our findings, visit the virtual conference on Wednesday, March 10, 2021 1:30 to 3:00pm EST.

To register for the Virtual IPC APEX Expo and Conference please click here.

To learn more about MacDermid Alpha’s latest innovations visit our website MacDermidAlpha.com.