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Latest Technology Offerings Promoted at the International Electronics Circuit Exhibition
(Waterbury, CT USA) – MacDermid Alpha Electronics Solutions will be exhibiting at the International Electronics Circuit Exhibition hosted by the Hong Kong Printed Circuit Association. The show will be held from December 2-4, 2020 at the Shenzhen Convention and Exhibition Center, China.
MacDermid Alpha will be featuring its complete portfolio of metallization technologies from the MacDermid Alpha brand for HDI designs that provide a continuous metalurgical structure for the most demanding requirements in micro via reliability. MacDermid Alpha will also showcase its product offerings that enable 5G from start to finish from all three divisions and four brands. Also highlighted will be the recently released processes in the IC Substrate market; Systek SAP – high performance build-up processes, Systek UVF 100 – via fill and fine line plating for 2-in-1 RDL applications, and Systek ETS 1200 – pattern plating metallization for embedded trace substrates.
Interested participants can stop by booth, 2M13, to talk to our industry experts about the latest offerings from MacDermid Alpha.
Find out more at MacDermidAlpha.com or email us at techinfo@macdermidalpha.com.
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