Paper Presentation on Ultra-Low Temperature Solder for Flexible Hybrid Electronics at Virtual Conference

Rahul Raut, Director of Strategy and Technology Acquisition, will present on MacDermid Alpha’s latest advances in ultra-low temperature solders which target the fast growing flexible hybrid electronics market. His presentation will focus on innovative chemistries which enable soldering at peak reflow temperatures below 150°C, as well as permitting cascaded/hierarchical soldering, including novel hermetic sealing solutions. These capabilities are ideal for soldering heat sensitive components and sub-assemblies. “With ALPHA OM-220 ultra-low temperature solder paste, which enables soldering below 150 °C, we can now use heat-stabilized PET substrates in flexible hybrid electronics”, said Rahul Raut.“This capability opens up tremendous options for more sophisticated FPC assemblies.”

The TechBlick virtual event will be held from May 11 - 12, 2021. To register for this presentation, click here (TechBlick) . More information about MacDermid Alpha’s solutions for flexible and in-mold electronics can be found at (link).