Three Technical Papers Presented at SMTA China East Technical Conference 2021

Ever evolving packaging and assembly requirements have been driving the design of solder alloys with higher thermal and mechanical reliability. Low temperature solders (LTS) can potentially reduce material and energy costs, promote long-term reliability, and help reduce labor and equipment maintenance costs. The paper “High-Reliability, Fourth Generation Low-Temperature Solders: Improving Drop Shock Performance” will discuss how the drop shock performance of third and fourth generation SnBi solder alloys is affected by alloy melting behavior, processing, and assembly conditions.

Hole fill requirements in Types II and III assemblies had traditionally required the use of silver bearing lead-free alloys during wave soldering. As a result of continuous alloy developments, an opportunity now exists to employ a silver-free, lead-free alloy that can meet such hole fill requirements. The second paper “Can Low Cost Silver-Free Alloys Be Used in Type II and III Assemblies?” lays out the key elements working together to deliver optimal performance at the lowest cost currently available in a matured process by applying SAC305.

Printed circuit board (PCB) assemblers are increasingly using Organic Solderability Preservatives (OSP) as their preferred surface finish due to several advantages of this coating over metallic surface finishes. However, OSP coatings after exposure to one or more thermal excursions can become more challenging to solder especially during wave solder applications. The third paper “Can All Liquid Fluxes Work Well on A Reflowed OSP Pad Finish?” focuses on the investigation of the chemical changes OSP coating undergoes in thermal excursions.

SMTA China East Technology Conference
Date: April 21st – 22nd 2021
Venue: Room No. 6, B2, Shanghai World Expo Exhibition & Convention Centre
Speaker: William Yu, Senior Technical Services Manager

Topic 1: High-Reliability, Fourth Generation Low-Temperature Solders: Improving Drop Shock Performance
Date/time: April 21st (Wed) / 11:55-12:30

Topic 2: Can Low Cost Silver-Free Alloys Be Used in Type II and III Assemblies?
Date/Time: April 22nd (Thu) / 10:45-11:20

Topic 3: Can All Liquid Fluxes Work Well on A Reflowed OSP Pad Finish?
Date/Time: April 22nd (Thu) / 14:20-14:55