Thermal management is of utmost importance in power semiconductors, commonly including power Metal-oxide-semiconductor Field-effect Transistors (MOSFETs), power diodes, thyristors and Insulated-gate Bipolar Transistors (IGBTs). Compared with low-power packages, power devices carry a larger amount of current and withstand a higher reverse-bias voltage in the off-state. The large current conduction inevitably heats up the power semiconductor, making the rapid and continuous transfer of heat out of the power device a critical feature.
Our state-of-the-art silver sintering technologies face these challenges, such as our full silver sintering product line, ARGOMAX, and our hybrid silver sintering product series, ATROX 800HT/850HT. ARGOMAX adopts low pressure sintering technology, while the ATROX 800HT/850HT series uses pressureless sintering technology. Both product line along with our high reliability solder paste and preform create thermally and electrically conductive connections, the most effective thermal management solutions for power semiconductors.