STAYSTIK®

Thermoplastic Adhesives

STAYSTIK products are a complete line of high purity, low ionic, thermoplastics specifically developed to meet stringent industry reliability standards, including JEDEC and MIL STD 883 requirements.

STAYSTIK is available in film or paste form, allowing process flexibility, as well as a variety of filler technologies (silver, aluminum nitride, alumina and non-filled). STAYSTIK polymer systems allow for a wide range of temporary or permanent bonding applications including substrate attach.

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POLYSOLDER®

Silver Filled Epoxy

Specifically designed for electronic component assembly; POLYSOLDER is a lead-free, no clean and environmentally friendly conductive adhesive. Tailored rheology allows for a variety of application methods including screen printing, stencil printing or dispensing. POLYSOLDER is bonded by thermal processing in IR, convention or box oven equipment. Enabling low temperature processing and fast bonding with substantial stress absorbing properties, POLYSOLDER is a unique silver filled polymer matrix that forms stable electrical and mechanical junctions with standard components and substrates, even after extensive environmental aging.

STAYCHIP®

Encapsulant and Bonding Applications

STAYCHIP epoxies are a unique line of specially developed adhesives for a variety of bonding applications requiring stress relief and adhesive properties after environmental aging.

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  • ATROX® CF200-1D

    The ATROX brand of conductive die attach films are designed to provide you with superior performance for today's stringent reliability requirements.

    • ATROX CF200-1D is a conductive film adhesive with high electrical and thermal conductive properties. 
    • The unique chemistry allows excellent process flexibility and superior reliability performance to a variety of die sizes used for semiconductor applications.
  • ATROX® CF100-7B

    The ATROX brand of conductive die attach films are designed to provide you with superior performance for today's stringent reliability requirements.

    • Excellent thermal conductivity > 10 W/m-K
    • Produces high thermal and electrical conductivity silver bonds with conventional die attach film processes.
    • Can be laminated on wafer backside with moderate temperatures (< 100C).
  • STAYCHIP® F614-3A

    Non-conductive and Electrically Insulating Adhesive

    • Fast bonding to a variety of substrates
    • Electrically insulating
    • Low ionics
    • Low outgassing 
  • STAYCHIP® F614-2

    Non-conductive and Electrically Insulating Adhesive

    • Fast bonding to a variety of substrates
    • Electrically insulating
    • Low ionics
    • Low outgassing 
  • STAYSTIK® 336T

    Solvent-based Polymer Specially Developed for Temporary Bonding Applications

    • Fast bonding to a variety of substrates
    • Easily reworkable material
  • STAYSTIK® 492

    Non-filled Dielectric Interposer Film

    • Fast bonding to a variety of substrates
    • Easily reworkable material
  • STAYSTIK® 892

    Alumina Filled Dielectric Film

    • Fast bonding to a variety of substrates
    • Easily reworkable material
  • STAYSTIK® 591

    Silver-filled Electrically Conductive Film

    • Fast bonding to a variety of substrates
    • Easily reworkable material
  • STAYSTIK® 393

    Non-filled Dielectric Interposer Paste

    • Fast bonding to a variety of substrates
    • Easily reworkable material
  • STAYSTIK® 793

    Alumina Filled Dielectric Paste

    • Fast bonding to a variety of substrates
    • Easily reworkable material
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