Adhesives

Thermoplastic Adhesives

STAYSTIK products are a complete line of high purity, low ionic, thermoplastics specifically developed to meet stringent industry reliability standards, including JEDEC and MIL STD 883 requirements.

STAYSTIK is available in film or paste form, allowing process flexibility, as well as a variety of filler technologies (silver, aluminum nitride, alumina and non-filled). STAYSTIK polymer systems allow for a wide range of temporary or permanent bonding applications including substrate attach.

Silver Filled Epoxy

Specifically designed for electronic component assembly; POLYSOLDER is a lead-free, no clean and environmentally friendly conductive adhesive. Tailored rheology allows for a variety of application methods including screen printing, stencil printing or dispensing. POLYSOLDER is bonded by thermal processing in IR, convention or box oven equipment. Enabling low temperature processing and fast bonding with substantial stress absorbing properties, POLYSOLDER is a unique silver filled polymer matrix that forms stable electrical and mechanical junctions with standard components and substrates, even after extensive environmental aging.

Encapsulant and Bonding Applications

STAYCHIP epoxies are a unique line of specially developed adhesives for a variety of bonding applications requiring stress relief and adhesive properties after environmental aging.

Product List

SelectSTAYCHIP F614-3ASTAYCHIP F614-2Go