High Thermal Conductivity Die Attach Film

ATROX CF200-1D high thermal and electrical conductivity film is designed for die attach assembly of semiconductor packages. The film offers excellent bond-ability to a variety of leadframe surfaces and die sizes with no resin bleed out (RBO). The bondline thickness is controlled accurately with no die tilting issues resulting in high yield assembly. The low outgassing property of the film ensures superior reliability and Moisture Sensitivity Level (MSL) performance.

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ATROX-DIE-ATTACH
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ATROX-DIE-ATTACH
Hybrid Silver Sintering Die Attach

The ATROX 800HT Series is a thermosetting conductive die attach adhesive with high thermal conductivity (>100 W/m-K) designed for high power semiconductors and exposed pad semiconductor packages. It has excellent adhesive strength to NiPdAu, Ag and MEP leadframes, low out gassing, which minimizes oven contamination, and is ideal for excellent MSL performance.

Sintered Die Attach

Advanced sinter and solder solutions addressing a wide variety of challenges for power electronics. Our engineered sinter materials are proven to enable high throughput and reliability while providing flexible and easy-to-use form factors that reduce the capital cost and accelerate time to market.

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ALPHA Argomax 8031 wafer

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  • ALPHA® Argomax® 8020 Film

    Sinter Silver Film for Die Attachment

    • Die-Transfer-Film (DTF) process
    • Designed for Ag/Au surfaces
    • Customized for fast and easy die and spacer lamination 
    • Pure silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing 
    • Die attach temperatures suitable for semiconductor manufacturing 
       
  • ALPHA® Argomax® 2047 Paste

    Sinter Silver Paste for Package Sinter Attachment

    • Application: Package/Module Attach, Substrate Attach
    • Formulated for printing on Ag/Au surfaces
    • Designed for component placement on wet paste with high tack 
    • Pure Silver bond line for high performance (thermal and electrical conductivity) and reliability
    • Flexible bond line thickness 
    • Low sintering pressure for high yield manufacturing 
       
  • ALPHA® Argomax® 2048 Paste

    Sinter Silver Paste for Package Sinter Attachment

    • Application: Package/Module Attach, Substrate Attach
    • Formulated for large area dispense on Ag/Au surfaces
    • Designed for component placement on wet paste with high tack
    • Pure Silver bond line for high performance (thermal and electrical conductivity) and reliability 
    • Low sintering pressure for high yield manufacturing 
    • Design allows for thick dispense volumes providing bond lines suitable for large areas 
    • Flexible bondline thickness
  • ALPHA® Argomax® 5022 Paste

    Sinter Silver Paste for Die Attachment on Copper Surface

    • Application: Die Attach, Die Top Attach
    • Formulated for printing on Cu surfaces
    • Designed for die placement on dried paste
    • Pure Silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing
  • ALPHA® Argomax® 2040 Paste

    Sinter Silver Paste for Die Attachment (Print and Dispense) with Wet Die Placement 

    • Applications: Die Attach, Die Top Attach
    • Formulated for printing or dot dispense on Ag/Au surfaces 
    • Designed for die placement on wet paste
    • Pure Silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing  
    • Proven long stencil life
  • ALPHA® NCP-1213

    High lead, Zero-halogen, No clean Solder Paste

    • Excellent voiding performance on die attach applications
    • Excellent dispensing consistency
    • High reliability die attach connection for high power semiconductor applications
  • ATROX® NC300-1

    ATROX Brand of die attach pastes are designed to provide you with superior performance for todays stringent reliability requirements. The die attach products (ATROX) offer complete solution with lower total cost of ownership ushering a new era of high performance materials.

    • Electrically insulating High Reliability die attach
    • Moderate stress for all die sizes
    • Robust adhesion on metal and non-metal surfaces: Ag, Cu, PPF, Au, Si, substrate, etc.
    • Excellent ㅇispensability for high throughput
  • ATROX® NC200-3

    ATROX Brand of die attach pastes are designed to provide you with superior performance for todays stringent reliability requirements. The die attach products (ATROX) offer complete solution with lower total cost of ownership ushering a new era of high performance materials.

    • Low stress material for excellent reliability
    • Compatible with multiple leadframe surfaces: Ag, Cu & PPF (NiPdAu) and soldermask
    • Compatible with Bare Si and metalized die surfaces
  • ALPHA® Argomax® 2010C Paste

    Sinter Silver Sintering Paste for Die Attachment 

    • Applications: Die Attach, Die Top Attach
    • Formulated for printing on Ag/Au surfaces
    • Designed for die placement on dried paste
    • Pure Silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing  
    • Proven long stencil life
  • ALPHA® Argomax® 8035 Film

    Sinter Silver Film for Die Attachment – Wafer Level Processing with Copper surface Die attach

    • Designed specifically for wafer dicing after lamination with dicing tape 
    • Formulated for Cu surface die attach
    • Film can be cut to custom sizes
    • Pure silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing 
    • Die attach temperatures suitable for semiconductor manufacturing 
       
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