MICROFAB EVF NiBAR - Boric Acid Free Ni

Green initiatives are part of MacDermid Alpha’s product line roadmap. Keeping up with global regulatory concerns and needs has led to industry leading boric acid free electrolytic nickel for barrier and capable of viafill, bump, UBM and RDL. MICROFAB EVF NiBAR is the next generation of Ni barrier technology that is stress and viafill selectable.

  • Boric Acid Free – EHS and Regulatory Compliant
  • Viafill capable
  • Stress tunable
  • Low temperature
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Plating Nickel -Macdermid Alpha
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Plating Nickel -Macdermid Alpha
MICROFAB NI-200 – Bright Barrier

MICROFAB NI-200 is an industry leading sulfamate nickel electroplating process that produces a pure, ductile, fine-grained, bright low stress nickel deposit required to meet the needs of the semiconductor industry.

  • Bright - Smooth
  • Barrier
  • Small grain

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MICROFAB NI-100 – Matte Barrier

MICROFAB NI-100 is a nickel sulfamate electroplating process that produces a pure, ductile, fine-grained, matte, and low-stress nickel deposit required to meet the needs of the semiconductor industry.

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Plating Nickel -Macdermid Alpha

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  • NOVAFAB® BA 800

    Wafer Level Packaging (WLP) continues to demand high yield, high performance packages, MacDermid Alpha is growing it’s WLP portfolio of innovation driven by requests for viafill Ni and stress tunable solutions. NOVAFAB BA 800 has the same barrier performance as NI-100 & NI-200 and is viafill capable.

    • Bright/smooth
    • High speed
    • Small grain size
    • Stress tunable
    • Excellent coplanarity
       
  • MICROFAB® EVF NiBAR

    Wafer Level Packaging (WLP) continues to demand high yield, high performance packages, MacDermid Alpha is growing it’s WLP portfolio of innovation driven by green initiatives while building on industry leading barrier technology.

    • High speed deposition
    • Bright/smooth
    • Small grain size
    • Stress tunable
    • Low temperature
       
  • MICROFAB® NI-200

    Wafer Level Packaging (WLP) continues to demand high yield, high performance packages, MacDermid Alpha's barrier technology is leading the way.

    • High speed 
    • Bright/smooth
    • Small grain size
    • Lead-free
       
  • MICROFAB® NI-100

    Wafer Level Packaging (WLP) continues to demand high yield, high performance packages, MacDermid Alpha's barrier technology is leading the way.

    • High speed deposition
    • Matte
    • Lead-free
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