MICROFAB AU660

MICROFAB AU660 enables a single solution for backside interconnect (via liner) and fine pitch pattern gold bumping. It excels at high plating rates (> 0.5µm /min) and step coverage (~2X vs. conventional Gold plating) enabling field thinning that can result in lower cost of ownership. MICROFAB AU660 is also surface roughness adjustable and capable of < 20nm Ra. This solution is perfectly paired with MICROFAB AU100 DEPLATE for superior seed removal uniformity.

  • 1.5 – 2.0X improved step coverage
  • High plating rates > than 0.5 um/min
  • Cyanide free
  • Uniform post seed etch surface roughness

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Plating Precious Metal-Macdermid Alpha
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Plating Precious Metal-Macdermid Alpha
MICROFAB DEPLATE

Non-cyanide gold seed deplate for applications when non-uniformity is a must. This solution comes in two versions compatible with Ti/Au or TiW/Au and produces a uniform surface when paired with MICROFAB AU660.

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NOVAFAB VIAFILL Au

Au initiatives are part of MacDermid Alpha’s product line roadmap. Keeping up with global trends in Micro-LED and UBM replacement needs has led to an industry leading gold capable of via filling and is part of the next generation of Au systems now under the NOVAFAB trademark.

  • Viafill
  • Low surface roughness
  • Cyanide, arsenic, thallium and lead free
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Plating Precious Metal-Macdermid Alpha

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  • NEUTORNEX STRIKE

    Specifically designed to aid adhesion and rid unwanted contamination from entering the main gold plating solution.

    • Adhesion aid
    • Impurity aid
    • Lead-free
    • Arsenic-free
    • Cyanide-free
    • Thallium-free
  • MICROFAB® AU100 CT DEPLATE

    Gold plating solutions have evolved dramatically over the years to achieve fine line, step coverage and bump plating. To further reduce operating costs MacDermid Alpha has developed a non-cyanide deplate to accompany our best in class gold solutions.

    • Deplate only – Ti compatible
    • Uniform post gold seed etch
    • Lead-free
    • Arsenic-free
    • Cyanide-free
    • Thallium-free
  • MICROFAB® AU100 DEPLATE

    Gold plating solutions have evolved dramatically over the years to achieve fine line, step coverage and bump plating. To further reduce operating costs MacDermid Alpha has developed a non-cyanide deplate to accompany our best in class gold solutions.

    • Deplate only – Ti compatible
    • Uniform post gold seed etch
    • Lead-free
    • Arsenic-free
    • Cyanide-free
    • Thallium-free
  • MICROFAB® AU310-T

    MICROFAB AU310-T enables an arsenic free bright plating solution with superior surface roughness for fine pitch pattern gold bumping.

    • High purity – soft gold
    • Columnar
    • Superior surface roughness
    • Uniform post gold seed etch
    • Lead-free
    • Arsenic-free
    • Cyanide-free
  • BDT-510

    BDT-510 is a historical workhorse known for its bright appearance and ease-of-use.

    • Superior surface roughness
    • High purity – soft gold
    • Lead-free
    • Cyanide-free
    • Thallium-free
  • BDT-200

    BDT-200 is a historical workhorse known for its bright appearance and ease-of-use.

    • Good step coverage
    • Superior surface roughness
    • High purity – soft gold
    • Lead-free
    • Cyanide-free
    • Thallium-free
  • NOVAFAB® VIAFILL AU

    NOVAFAB VIAFILL AU is designed for low aspect ratio vias seen in Micro-LED manufacturing using a conformal seed. Seem voids are eliminated, and smooth surface roughness is achieved.

    • Viafill capable
    • High purity – soft gold
    • Superior surface roughness
    • Lead-free
    • Arsenic-free
       
  • NEUTRONEX 309

    NEUTRONEX 309 is a historic cyanide free BKM for filters, opto-semi and power management.

    • Good step coverage
    • High purity – soft gold
    • Low surface roughness
    • Lead-free
  • MICROFAB® AU3151B

    MICROFAB Au3151B creates 'high hardness' gold bumping with a hardness adjuster. This process is not possible with a conventional gold process. MICROFAB Au3151B is best suited for semiconductor wafers for Au bump plating process or processes that require less grain growth during heat treatment.

    • High speed deposition
    • High hardness
    • Uniform post gold seed etch
  • MICROFAB® AU660

    MICROFAB AU660 enables a single solution for backside interconnect (via liner) and fine pitch pattern gold bumping. It excels at high plating rates (> 0.5µm /min) and step coverage (~2X vs. conventional Gold plating) enabling field thinning that can result in lower cost of ownership.

    • High speed gold deposition
    • Superior step coverage
    • Uniform post gold seed etch 
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