MICROFAB® TS-650 NXG

Wafer bumping tin-silver alloys are providing the benefits of pure tin without the drawbacks. MacDermid Alpha’s MICROFAB TS-650 NXG is the Sn/Ag bump, pillar, and capping metallization process to choose for your WLP designs when coplanarity, bond strength, and process throughput are paramount. Tunable Sn/Ag alloy produced by MICROFAB TS-650 NXG removes the propensity for whiskering while providing a lower melting point for reflow and a higher resistance to mechanical stress. Developed to perform alongside the MacDermid Alpha industry-leading copper pillar plating technologies, MICROFAB TS-650 NXG is the solution of choice for excellent solderability of chip or package to substrate.

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Plating Solder-Macdermid Alpha
Plating Solder-Macdermid Alpha

MICROFAB® SN-350

Wafer bumping pure tin is providing a lower cost and ease of use solder interconnect. MacDermid Alpha’s MICROFAB SN-350 is the pure Sn bump, pillar, and capping metallization process to choose for your WLP designs when coplanarity, bond strength, and process throughput are paramount. Developed to perform alongside MacDermid Alpha’s industry-leading copper pillar plating technologies, MICROFAB TS-350 is the solution of choice for excellent solderability of chip or package to substrate.

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  • MICROFAB® TS-650 NXG

    MICROFAB TS-650 NXG tin silver bump metallization bath is an organic sulfonate-based electrolyte designed for use in semiconductor wafer plating. It is suited for high-speed electrodeposition producing smooth surface morphology, solderable reflowed bumps with tight control alloy compositions.

    • Low temp solder
    • Low alpha
    • Smooth deposit
    • Excellent coplanarity
    • Low surface roughness
    • High speed
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  • MICROFAB® SN-350

    MICROFAB SN-350 is a high-speed, low alpha pure tin plating process that produces compact grain structures and smooth surface morphology, which is used for flip chip bumping and microbump applications.

    • Pure tin
    • Low alpha
    • Smooth deposit
    • Excellent coplanarity
    • Low surface roughness
    • High speed
       
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  • MICROFAB® SN-300 / 302

    MICROFAB SN-300 / 302 is a high-speed low alpha pure tin plating process that produces compact grain structures and uniform surface morphology which is used for flip chip bumping and microbump applications.

    • Pure tin
    • Low alpha
    • Matte
    • High Speed
    • Lead-free
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