Excellent Soldering Yield on Various Finishes

Semiconductor Solutions no clean and water soluble paste flux delivers robust and high yield for solder ball attach, flip chip and other soldering applications.

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Robust Application for Various Package Designs

ALPHA Paste Flux is the leading choice of solder flux for wafer level CSP, Flip chip and BGA/ CSP ball attach applications.

  • Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process.
  • Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates.
  • Excellent material stability whereas the flux maintains tack and viscosity over multiple print cycles. 
  • Excellent cleanability performance in that residues are easily cleaned with DI water.

View Products in Solder Flux

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  • ALPHA® WS-608

    ALPHA WS-608 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes, excellent cleaning and enables low voiding performance.

    • Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
    • Superior wetting maximizing assembly yields to provide highest ball attach yield rates
    • Excellent cleanability performance in that residues are easily cleaned with DI water
  • ALPHA® WS-630

    ALPHA WS-630 is a water soluble high activity paste flux that delivers excellent solder wetting on challenging finishes and enables low voiding performance.

    • Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
    • Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates
    • Excellent cleanability performance in that residues are easily cleaned with DI water
  • ALPHA® NCX-PRL507

    ALPHA NCX-PRL507 is an epoxy paste flux for wafer level ball attach for both Fan-in and Fan-out applications. It can also be used as a flip chip flux for wafer level packaging.

    • Superior activity, wetting, and assembly yield rates
    • High Tg polymer reinforcement layer
    • Excellent material stability – maintains tack and viscosity over multiple print cycles
    • Improved ball shear strength, drop shock, and temperature cycle reliability performance
  • KESTER SE-CURE 9665

    No clean low residue liquid flux for indium solder preform thermal interface lid attach.

    • Excellent soldering especially for indium solder preforms
    • Very low voiding even after multiple reflows for indium TIM application
  • KESTER TSF-ULR18

    No clean paste flux with low residue post reflow and low voiding performance.

    • Ultra low residue post reflow; <10% by Wt
    • Excellent for Flip Chip on leadframe package
    • Halide and halogen-free formulation 
  • KESTER TSF-6592HF

    No clean paste flux with high activity and clear residues.

    • Bright shiny solder joints with clear residues
    • Aggressive flux on various substrates such as OSP-Cu, immersion finishes and ENIG
    • Clear non-tacky residues
    • High tack to minimize skewing of components
  • KESTER TSF-6522RH

    No clean rosin-based paste flux with high tackiness and long pot life.

    • High tack values and long tack life
    • ROL0 IPC classification
    • Excellent for Flip chip on lead and flexible circuits application
  • ALPHA® OA1303

    Water soluble liquid flux for wafer level electroplated bump reform.

    • Excellent activity allows for superior wetting, maximizing wetting and bump reforming
    • Best adapted to bump forming process of lead free SAC alloys
    • Excellent cleanability; residues are easily cleaned with DI water
    • Suitable for various wafer sizes up to 300mm
  • ALPHA® WS9160-M7

    Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications.

    • Excellent activity allows for excellent soldering to Cu UBM, Cu OSP and ENIG soldering process
    • Excellent wettability: Excellent activity reduces the occurrence of dark balls
    • Excellent cleanability: Flux residues are removed easily with warm DI water
    • High tackiness allows high yields for wafer level ball attach
  • ALPHA® WS9180-MHV

    Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications.

    • Excellent activity allows for excellent soldering to Cu, Cu OSP and ENIG soldering process
    • Excellent material stability – maintains viscosity tack and viscosity over time
    • Wide process window for maximum application flexibility especially for wafer level ball attach
    • Excellent print and pin-transfer stability
       
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