Kester Indium Solder Thermal Interface Materials Provide:
  • High purity materials and production processes
  • Improved final yields and reliability through low voiding with unique flux chemistries
  • High degree of flexibility in preform geometry and packaging style
  • Excellent mechanical strength and wetting to various metallizations (i.e. Ag, Au)
  • Extremely wide processing window in multiple reflow profiles
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Electrolube's Thermal Interface Materials

During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the compound and the device can lead to reliability concerns and reduced operational lifetime. Electrolube's extensive thermal interface materials & thermal solutions range is designed to help reduce the operating temperature of many different electronic devices. With any thermal application we would always advise testing before final selection as the requirements and operating environment will vary for each application.

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  • Kester Indium Solder TIM

    Kester Indium solder thermal interface material (TIM) provides a non-adhesive or non-organic interconnect between the die level interface and the heat spreader to enable uniform thermal dissipation.

    • High purity materials and production processes
    • Improved final yields and reliability through low voiding with unique flux chemistries
    • High degree of flexibility in preform geometry and packaging style
    • Excellent mechanical strength and wetting to various metallizations (i.e. Ag, Au)
    • Extremely wide processing window in multiple reflow profiles
       
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