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Product Overview
The MICROFAB SPM-1100 process is engineered for high-speed pillar, copper stud and Under-Bump Metallization (UBM) applications. It provides exceptional within-wafer, within-die, and within-feature uniformity.
Features
- Pillar / Post
- Excellent coplanarity
- High speed
- High throughput
- Flat bump shape
- Low voiding
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Next Generation High Speed Solution
MICROFAB SPM-1100 is a next generation high speed solution and is a perfect replacement for industry leading MICROFAB SC copper solutions where >COP and plating rate is desired. It is also perfectly mated with our Boric Acid free Ni barrier and Tin Silver solutions (MICROFAB EVF NiBar) (MICROFAB TS-650)
- Flat bump shape
- Excellent Coplanarity
- High Speed Deposition
3-Components Chemistry Designed
3-components chemistry designed solely for pillar applications capable of a wide range of aspect ratios with plating speed up to 3.0- 5.0 µm/min. Designed to be compatible with Pb-Free solder with or without a Ni Barrier process by utilizing crown technology.
MICROFAB SPM-1100
|
Product Name |
Cu Packaging Solution |
Cu Process Feature |
Feature-Property Benefit |
|---|---|---|---|
|
MICROFAB SPM-1100 |
Pillar/Post |
High Speed |
High Through-put |
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