Product Overview

NEUTRONEX 309 is an alkaline, non-cyanide, thallium-based gold electroplating process. It is also available as a thallium-free process.

Features

  • Good step coverage
  • High purity – soft gold
  • Low surface roughness
  • Lead-free

For consultation with one of our experts and access to detailed technical data , please fill out and submit the contact us form.

NEUTRONEX 309

Product Name

PM Process Feature

PM Metal Property

PM EHS Friendly

NEUTRONEX 309

Good Step Coverage

High Purity – Soft Gold
Low Surface Roughness

Lead-Free
Arsenic-Free
Cyanide-Free

Key Barrier Materials and Gold Plating Solutions.

  • Backside metallization
  • Micro-LED
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU3151 B WH MICROFAB AU100 Deplate MICROFAB AU100 CT Deplate

Key Barrier Materials and Gold Plating Solutions.

  • Backside metallization
  • Micro-LED
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU3151 B WH MICROFAB AU100 Deplate MICROFAB AU100 CT Deplate

Low COO and EHS Compliance

Neutronex Au gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

Neutronex Au gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

Neutronex gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping

Low COO and EHS Compliance

Neutronex gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping

Key Barrier Materials and Gold Plating Solutions.

  • Backside metallization
  • Micro-LED
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU3151 B WH MICROFAB AU100 Deplate MICROFAB AU100 CT Deplate

Key Barrier Materials and Gold Plating Solutions.

  • Backside metallization
  • Micro-LED
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU3151 B WH MICROFAB AU100 Deplate MICROFAB AU100 CT Deplate

Low COO and EHS Compliance

Neutronex Au gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

Neutronex Au gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

Neutronex gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping

Low COO and EHS Compliance

Neutronex gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping
What do you need solved?
Let our experts find your solution.
Contact Us