Product Overview

KESTER TSF-6522RH is a no clean rosin-based paste flux, designed to meet IPC halogen-free requirements. TSF-6522RH is formulated for customers familiar with Kester's leading TSF-6522 flux, but now must comply to halogen-free requirements.

Features

  • High tack values and long tack life
  • ROL0 IPC classification
  • Excellent for Flip chip on lead and flexible circuits application

No-Clean Tacky Soldering Flux

Technical Data Sheets
TDS-icon

TSF-6522RH Technical Data Sheet English

Product Flyer
Documentation icon - Flyer

TSF-6522RH Product Flyer English

Kester TSF-6522RH

Product Name

Flux Type

Flux Process

Component Type

TSF-6522RH

No Clean

Ball Attach
Flip Chip Attach

BGA / CSP
FC
FC-QFN

High Activity No-Clean Flux

  • Excellent reflow yields
  • High reliability solder joints
NCX-390 Kester TSF6592HF

High Activity No-Clean Flux

  • Excellent reflow yields
  • High reliability solder joints
NCX-390 Kester TSF6592HF

High Reliability No-Clean Soldering Solutions

Please see Solutions page for details.

Sphere Attach Flip Chip attach

High Reliability No-Clean Soldering Solutions

Please see Solutions page for details.

Sphere Attach Flip Chip attach

High Activity No-Clean Flux

  • Excellent reflow yields
  • High reliability solder joints
NCX-390 Kester TSF6592HF

High Activity No-Clean Flux

  • Excellent reflow yields
  • High reliability solder joints
NCX-390 Kester TSF6592HF

High Reliability No-Clean Soldering Solutions

Please see Solutions page for details.

Sphere Attach Flip Chip attach

High Reliability No-Clean Soldering Solutions

Please see Solutions page for details.

Sphere Attach Flip Chip attach
What do you need solved?
Let our experts find your solution.
Contact Us