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- ALPHA® Argomax® 6500 Bond Pad
SinteReady Bond Pad Supports Copper Wire bonding / Ribbon bonding
- Hot tacking capable for assembly without glue dots
- Target sinter bondline options of 12µm and 25µm
- Customer defined dimensions, including foil thickness
- Fast hot tacking time for high throughput
- Low sinter pressure, low sinter temperature
- Tape and reel packaging
- ALPHA® Argomax® 6100 Laminated Clips
SinteReady Laminated Clip with ALPHA Argomax Film
- SinteReady die top to substrate interconnect
- Target bondline range of 10-50µm
- Hot Tacking Capable based on ALPHA Argomax Film
- Compatible with Ag, Au and Cu metallization surfaces
- Low sinter pressure and low sinter temperature
- Fast sinter time for high manufacturing throughput
- Tape and reel packaging
- ALPHA® Argomax® 9500 Sinter Preforms
SinteReady Preforms for Copper Metallization Surfaces
- Ready to sinter dry placement interconnect compatible with Copper metallization surfaces
- Target total bondline range of 50-250µm
- Customer defined dimensions
- Low sinter pressure, low sinter temperature
- Fast sinter time for high yield manufacturing
- Tape and reel packaging
- ALPHA® Argomax® 9200 Sinter Preforms
SinteReady Preforms for Silver & Gold Metallization Surfaces
- Ready to sinter dry placement interconnect compatible with Ag and Au metallization surfaces
- Target total bondline range of 50-250µm
- Customer defined dimensions
- Compatible with Ag and Au metallization surfaces
- Low sinter pressure, low sinter temperature
- Fast sinter time for high yield manufacturing
- Tape and reel packaging
- ALPHA® Argomax® 8035 Film
Sinter Silver Film for Die Attachment – Wafer Level Processing with Copper surface Die attach
- Designed specifically for wafer dicing after lamination with dicing tape
- Formulated for Cu surface die attach
- Film can be cut to custom sizes
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
- ALPHA® Argomax® 8031 Film
Sinter Silver Film for Die Attachment – Wafer Level Processing
- Designed specifically for wafer dicing after lamination with dicing tape
- Formulated for Ag/Au surface die attach
- Film can be cut to custom sizes
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
- ALPHA® Argomax® 8021 Film
Sinter Silver Film for Die Attachment
- Die Transfer Film (DTF) process
- Optimized for a wide range of surfaces
- Customized for fast and easy die and clip lamination
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
- ALPHA® Argomax® 8020 Film
Sinter Silver Film for Die Attachment
- Die-Transfer-Film (DTF) process
- Designed for Ag/Au surfaces
- Customized for fast and easy die and spacer lamination
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
- ALPHA® Argomax® 8010 Film
Sinter Silver Film for Large Area Lamination
- Large area lamination film solution
- Custom cut film sizes available
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- ALPHA® Argomax® 5040 Paste
Sinter Silver Paste for Die Attachment on Copper surface with Wet Die Placement
- Application: Die Attach, Die Top Attach
- Formulated for printing or dot dispense on Cu surfaces
- Designed for die placement on wet paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
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