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- ALPHA® WS-820 Solder Paste
ALPHA WS-820, a lead free, halide free, water soluble solder paste, offering the ideal combination of printability and flexibility in reflow profile window with excellent cleanability.
- Excellent print volume repeatability down to 12 mil (0.3mm)
- Flexibility across straight ramp or soak reflow profiles in air
- Excellent wetting characteristics on all standard surface finishes
- Cleanable with aqueous based cleaning systems after multiple reflows
- ALPHA® WS-809 Solder Paste
A tin-lead, water soluble solder paste designed for a broad range of SMT processes where aqueous post reflow cleaning is required.
- High throughput & yield with consistent print volumes at print speeds ranging 1–6 in/s
- Exhibits resistance to slumping and drying at temperature up to 19-29 °C (66 – 84°F) and 35-65% relative humidity
- Excellent cleanability after 2 reflows
- ALPHA® JP-500 Solder Paste
ALPHA JP-500 is a lead-free, zero halogen, no-clean solder paste designed for use in Jet Printers and approved for use with leading jetting equipment manufacturers.
- Deposit capability and processability of circular dimensions down to 0.25mm (0.010”)
- Excellent deposit consistency with high process capability index across all board designs
- Reduction in random solderballing levels, increasing first time yield
- Excellent pin-testability
- Available in Type 5 and Type 6 powder
- ALPHA® JP-501 Solder Paste
ALPHA JP-501 is a low temperature, lead-free, no-clean solder paste designed for use in Jet Printers.
- Low temperature reflow profiles enables the use of low Tg PCB
- Excellent deposit consistency with high process capability index across all board designs
- Reduction in random solderballing levels
- Excellent pin-test yield for single and double reflow
- Available in Type 5 powder
- ALPHA® OM-220 Solder Paste
ALPHA OM-220 is an ultra-low temperature, no clean, zero halogen solder paste paired with Alpha’s ULT1 alloy intended for soldering temperature sensitive components and substrates.
- Low peak reflow temperature <150 °C
- Reduction of warpage of components and substrates during reflow
- Excellent printing performance
- Minimal and clear colorless residue
- Excellent electrochemical reliability
- ALPHA® OM-5100 Solder Paste
A low residue, no-clean solder paste designed to maximize first pass yields. The rheologically formulated flux vehicle provides excellent repeatability and resistance to environmental conditions.
- Consistent fine-feature print volume repeatability
- Low post reflow residue
- Reduction in Mid chip solder ball defects
- Minimizes random solder balling
- ALPHA® OM-5300 Solder Paste
A no-clean solder paste that meets the demands of tin-lead soldering when lead free components are present in the circuit assembly.
- Fine feature Capability - High print deposit volume & low volume variability to 12mil
- Excellent response to pause performance, generating fewer defects
- Class III BGA voiding resistance even when SAC 305 BGA spheres are used
- Applicable with high volume PiP assemblies
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