News & Events

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MacdermidAlpha-Market
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News_PCB 101_Webinar_2Sep2021
Circuitry
Press Release
Hosting a Series of Online Webinars: PCB101 The Basics of Printed Circuit Board Fabrication
MacDermid Alpha Electronics Solutions will be hosting a series of free webinars covering the basics of building a printed circuit board. The series will begin Tuesday, October 27, 2020 1:00 – 3:00pm EST and will run every Tuesday until November 17.
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News_TPCA Taipei 20_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Exhibiting at TPCA and Presenting at IMPACT-EMAP 2020 Conference
MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.
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News_Semicon Taiwan 20_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Recent Product Launches Exhibited and Promoted at Semicon Taiwan
MacDermid Alpha Electronics Solutions will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.
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News_CIOE 20_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
MacDermid Alpha’s Kester Brand to Exhibit at China International Optoelectronic Exposition
The Kester brand of MacDermid Alpha Electronics Solutions will be represented by China Distributor, Shanghai Fairfield Electronic Technology Co., Ltd., at the China International Optoelectronic Exposition (CIOE) in Shenzhen, China from September 9-11.
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News_SMTA China 21_31Aug2021
Assembly
Press Release
Void Reduction & Silver Free Alloy Solutions Presented at SMTA South China Technology Conference
The Assembly Division will be presenting two technical papers; “Methods of Reducing or Eliminating Voids in BGA and BTC Devices” and “Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?” at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
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News_Systek ETS 1200_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - Systek ETS 1200 Pattern Plating Metallization for Embedded Trace Substrates
MacDermid Alpha Electronics Solutions announces the release of Systek ETS 1200, the latest addition to the Systek family of IC Substrate manufacturing solutions.
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News_SNEC 2020_2Sep2021
Assembly
Press Release
Technical Presentation on Advantages of Solder Paste in Shingling Interconnection at SNEC PV Power Expo China
The Assembly Division of MacDermid Alpha Electronics Solutions will present the technical paper “Advantages of Solder Paste in Shingling Interconnection” during the SNEC 14th (2020) International Photovoltaic (PV) Power Generation and Smart Energy Exhibition & Conference taking place from August 7-10 in Shanghai, China.
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News_Systek UVF 100_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - Systek UVF 100: 2 in 1 RDL Simultaneous Copper Via Filling and Fine Line Plating for IC Substrate Manufacturing
MacDermid Alpha Electronics Solutions announces the release of Systek UVF 100, the newest release in the Systek family of IC Substrate manufacturing solutions.
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News_Productronica_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
New Ultra-Low Temperature Solder and 5G Solutions Launching at Productronica China 2020
The Assembly Solutions Division of MacDermid Alpha Electronics Solutions will introduce its new ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.
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News_Automotive Electronics AS_Webinar_2Sep2021
Assembly
Press Release
MacDermid Alpha to Host Automotive Electronics Assembly Solutions Customer Webinar
The Assembly Solutions division of MacDermid Alpha Electronics Solutions is hosting a free, online customer webinar on the topic of Automotive Electronics Assembly Solutions. The webinar will take place on Wednesday 24th June at 15:00pm CET with Paul Salerno, Portfolio Manager – SMT as presenter.
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News_Systek SAP_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - Complete Semi-Additive Process for IC Substrates and Panel Level Packaging: Systek SAP
MacDermid Alpha Electronics Solutions announces the release of Systek SAP.
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News_SMT Global Packaging Panel_2Sep2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Technology Experts to Participate in Online Industry Panel Discussions
MacDermid Alpha Electronics Solutions will participate in two online panel discussions on Tuesday 2nd June; Recent Advances in Low Temperature Solders hosted by Global SMT & Packaging, and the SMT Printing Round Table hosted by the Surface Mount Technology Association (SMTA).
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