News & Events

Q&A with MacDermid Alpha’s Line of Business Director for Power Electronics, Julien Joguet, and Global Director of Strategic Accounts, Steve Brown

MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, introduces ALPHA® SF828-MBB. Designed for soldering small surface areas of wire and delivering excellent peel force and high machine cleanliness, this is MacDermid Alpha’s latest liquid flux for the photovoltaic market.

The new anti-counterfeit labeling process is designed to protect its customers by ensuring product authenticity and delivering the highest product quality and sustainability.

Leveraging change as a catalyst to enhance profitability in the printed circuit board (PCB) fabrication industry is both a strategic imperative and a promising opportunity. In an era of rapid technological evolution and shifting market dynamics, embracing change is not just a choice; it is a necessity. By continually adapting to new manufacturing technologies, materials, and design methodologies, PCB fabrication companies not only stay competitive but also drive increased profitability.

Improve board level reliability by reducing solder joint voiding below 10%

MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, launches ALPHA® OM-362, its latest next-generation low-void solder paste.

MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, will highlight its latest solutions from its Alpha, Electrolube, and Kester product brands. The range includes high-reliability alloys, solder pastes, adhesives, conformal coatings, and thermal interface materials with information available at stand A4 #349 at the Productronica Europe tradeshow from Tuesday 14 – Friday 17 November in Munich, Germany.

Traditional PCB fabrication leaves a toxic legacy in its wake, but a revolution is underway. There are eco-friendly alternatives reshaping the electronics industry and paving the way for a cleaner, greener future.

In the manufacture of advanced electronics, high-speed signal requirements are becoming common. As a result, printed circuit board (PCB) manufacturers, IC Substrate fabricators, and original equipment manufacturers (OEMs) are looking for solutions to enable them to build and design circuit boards that transmit at higher signal speeds than previously possible with standard manufacturing processes.

MacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Asia, held at Shanghai New International Expo Center - SNIEC, 29 - 31 August 2023. MacDermid Alpha’s experts and product portfolio will be on display in hall W2, booth 2F08. Our team of experts look forward to welcoming visitors and sharing innovative solutions for increased power, range, and reliability in EVs (Electric Vehicles).

MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, will showcase its integrated solutions of high-reliability solder pastes, alloys, reinforcement, and protective polymers engineered to deliver best-in-class board level reliability. The FIEE Brazil Electronics Trade Show is taking place July 18-21, 2023, in São Paulo, Brazil. The MacDermid Alpha team looks forward to meeting show visitors at booth L61.

MacDermid Alpha, a leader in integrated technologies and materials for the electronics industry, is pleased to announce its Channel Partnership Agreement with Amza Ltd. This strategic alliance commences with immediate effect and marks a significant milestone for both companies as they join forces to expand the distribution and sales of the Alpha® branded range of solder pastes, preforms, cored wires, and flux products across Israel, Gaza, and the West Bank area.

MacDermid Alpha Electronics Solutions celebrated the highly anticipated grand opening of its China Electronics Applications Center (CEAC) on June 2, 2023, in Pudong New Area, Shanghai. The center’s state-of-the-art capabilities encompass a wide range of services, including the rapid development of prototypes, precise reliability testing, and the exploration of ground-breaking application techniques.