News & Events

Image
MacdermidAlpha-Market
Image
SMTA Huntsville
Assembly, Circuitry, Semiconductor
Press Release
New Low Temperature Solder Paste to be featured at SMTA Huntsville Expo & Tech Forum
The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Huntsville Expo & Tech Forum on Tuesday, April 12 at The Jackson Center.
Image
Ravi Bhatkal presents to India industry association
Assembly
News
Ravi Bhatkal presents to The Centre for Nano Science and Engineering (CeNSE)
Ravi Bhatkal, Managing Director - India, presented to The Centre for Nano Science and Engineering (CeNSE) on Advanced Materials in Electronics Manufacturing.
Image
Image of Paul Salerno interview with EMS Now on Low Temp Solders
Assembly
Multimedia
Watch interview with Paul Salerno discussing applications & advantages of low temperature solders
Watch interview with EMSNOW - Up Close With Paul Salerno on applications and advantages of low temperature solder.
Image
Image of flexible electronics for LOPEC Paper promotion
Assembly, Circuitry, Semiconductor
Press Release
Technical Presentation on High Reliability Materials for 3D Structural Electronics at LOPEC 2022 Exhibition and Conference
MacDermid Alpha Electronics Solutions, will be presenting the technical paper “Next Generation Interconnect Materials for Smart, Functional, and 3D HMI Surfaces” at the LOPEC 2022 Exhibition and Conference taking place March 22 - 24, 2022 at the Messe München, Germany.
Image
ALPHA OM-565 HRL3 Solder Paste
Assembly
Press Release
Product Launch - ALPHA® OM-565 HRL3, Next Generation, Low Temperature Solder Paste
MacDermid Alpha Electronics Solutions, announces the launch of ALPHA OM-565 HRL3, next generation, high reliability low temperature solder paste formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages.
Image
Solder Joint Ruggedness graphic images of drop shock, high stress
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha to feature enhanced reliability solder pastes at SMTA Rocky Mountain & Dallas Expos
The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Rocky Mountain Expo & Tech Forum on Thursday, March 10 and at the SMTA Dallas Expo & Tech Forum on Tuesday, March 22.
Image
CircuEtch 300
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha Releases CircuEtch 300 Anisotropic Final Etch for SAP and mSAP
MacDermid Alpha Electronics Solutions, announces the release of CircuEtch 300, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.
Image
APEC Paper
Assembly
Press Release
MacDermid Alpha Presents Sinter Technology Technical Paper at APEC Power Electronics Conference 2022
(Waterbury, CT USA) – February 14, 2022 - The Power Electronics Division of MacDermid Alpha Electronics Solutions, will be presenting the technical paper “Automotive Traction Module Attach by Silver Sintering – Process, Performance, and Reliability” at the APEC 2022 Power Conference taking place from March 20-24, 2022 in Houston, Texas.
Image
imaps
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha to Exhibit and Present at the IMAPS Device Packaging Conference
MacDermid Alpha Electronics Solutions, will be exhibiting and presenting a paper at the IMAPS Device Packaging Conference at the WeKoPa Resort and Conference Center, Fountain Hills, AZ, March 7-10, 2022.
Image
Karl Pfluke
Assembly
Press Release
MacDermid Alpha Electronic Solutions Announces New District Sales Manager for Southeast United States Region
MacDermid Alpha Electronics Solutions, announces the appointment of Karl Pfluke as District Sales Manager of the Southeast supporting the Alpha and Kester Assembly brands.
Image
Beth Turner
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha’s Electrolube Awarded NextGen Best Paper
MacDermid Alpha Electronics Solutions, is pleased to announce that Electrolube’s Senior Technical Manager, Beth Turner, has been awarded NextGen Best Paper. The paper, entitled “Bio-based Encapsulation Resins: Good for the Environment, Good for Your Environment”, was selected by the IPC Technical Program Committee for its thought-provoking, well-researched analysis of bio-based chemicals that led to the development of Electrolube’s breakthrough bio-resins range.
Image
Peter Sarmanian Award
Assembly, Circuitry, Semiconductor
Press Release
IPC Honors MacDermid Alpha Electronic Solutions with Corporate Recognition Awards
IPC presented its highest corporate honors during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2022. The Peter Sarmanian Corporate Recognition Award was presented to MacDermid Alpha Electronics Solutions.
Image
SNEC Photovoltaic Logo May 24-26 Conference and Expo
China
SNEC China Conference & Expo
Conference
Assembly
MacDermid Alpha will be delivering a paper on its latest technology for optimizing multi busbar cell interconnection.
Image
SMTA Rocky Mountain
United States
SMTA Rocky Mountain Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Discover Alpha and Kester’s latest solutions for solder joint ruggedization at this one-day event.
Image
IMAPS 2022
United States
IMAPS Device and Packaging 2022 Booth # 23/24
Trade Show
Assembly, Circuitry, Semiconductor
Discover the latest solutions of Alpha, Electrolube, Kester, MacDermid Enthone, and Electrolube # 23/24
Image
Getters Webinar
United States
MacDermid Alpha Webinar: “The Critical Role of Getters in Hermetic Packages”
Webinar/Online
Circuitry, Semiconductor
Michael Previti will be presenting “The Critical Role of Getters in Hermetic Packages”.
Image
Image of warped circuit board to demonstrate issues and success with low temp solders
United States
Low Temperature Solder Solutions for Defect-free Next Generation Package Designs
Webinar/Online
Assembly
Webinar May 25 at 2 pm EST. Low temperature solder solutions have been gaining interest in recent years as a technology enabler for next generation chip-scale package designs. Recent alloying advancements led to the development of the HRL3 alloy that significantly improves reliability over traditional tin-bismuth (SnBi)-based low temperature solder alloys.
Image
Dallas SMTA 2022
United States
SMTA Dallas Chapter Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Visit our table at this one day event to discover our latest high reliability and low temperature assembly solutions.
Image
APEC 2022
United States
APEC- Applied Power Electronics Conference
Conference
Assembly
Gyan Dutt will be delivering a paper, Automotive Traction Module Attach by Silver Sintering, at the Applied Power Electronics Conference (APEC) which focuses on the practical and applied aspects of the power electronics business.
Image
SMTA Juraez Expo
Mexico
Juarez Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Discover MacDermid Alpha’s low voiding solutions which increase reliability, enhance electrical and thermal performance, and eliminate costly rework. Additionally, Francisco Gallegos, will present “Solder Void Causes and Industry Reduction Strategies” as part of the Technical Forum.
Image
Shenzhen Conference
China
SbSTC Shenzhen Technical Conference 2022
Conference
Assembly
Harvey Han, Product Manager of Electrolube, will be presenting a paper related to conformal coating at the SbSTC Shenzhen technical conference.
Image
Lopec Conference logo and dates of event
Germany
LOPEC 2022 International Exhibition / Conference for Printed Electronics
Conference
Assembly
International Exhibition and Conference for Printed Electronics. LOPEC is the leading conference and exhibition on the hot topic of organic and printed electronics. MacDermid Alpha will be presenting its latest research at this event.
Image
SMTA Huntsville
United States
Huntsville Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Featuring ALPHA OM-565 HRL3 solder paste, high reliability solutions including ALPHA CVP-390V and Kester NP505-HR solder pastes with Innolot alloy, and the ALPHA HiTech series of adhesive, edgebond, and underfills.
Image
PCIM 2022 Show May 2022
Germany
PCIM - Power Electronics Tradeshow and Conference
Trade Show
Assembly
MacDermid Alpha Electronics Solutions will exhibit its latest developments in Power Electronics Solutions at the PCIM tradeshow. Visit us in Hall 7 Booth #227
What do you need solved?
Let our experts find your solution.