Experts Present on Low Temperature Solder Solutions at Virtual Technical Conferences

Dr. Traian Cucu, Leader for the Global Applications and Technologies Experts Group, will present “Advanced Low Temperature Alloy Options for Increased Mechanical Performance” as part of the Low Temperature Solder (LTS) – Packaging Challenges of a Next-Generation SMT Interconnect Session at the ECTC on June 7 at 6 pm EDT. In his paper, Dr. Cucu will address the thermomechanical reliability of latest generation low temperature alloys with special emphasis on drop shock and thermal cycling performance. “The work being presented at this conference is critical to the industry, as the recent generation of low temperature solder alloys are engineered materials specificialy developed to address the latest assembly process requirements dictated by newer component designs“, said Cucu.

On June 16, Alan Plant, Regional Applications Manager for Europe, will present “Using LTS for Soldering Through Hole Components“ as part of the Low Temperature Soldering (LTS) Conference 2021. This paper will address the soldering performance of a newly developed Si-Bi based alloy and the preferred flux chemistries that ensure electrochemical reliability is maintained using lower processing temperatures. “The development of this alloy is an example of MacDermid Alpha’s continued commitment to advancing low temperature soldering technology.“ said Plant. In addition to contributing a paper, Macdermid Alpha is also a Platinum Sponsor for the conference.

More information on MacDermid Alpha’s low temperature solutions can be found at the MacDermid Alpha website (MAES). To register for the ECTC conference, click here (ECTC). To register for the LTS conference, click here (LTS).