Low Temperature Soldering and Conformal Coating Innovations presented at SMTconnect

Highlighted this year will be Alpha’s latest innovation in low temperature solutions, ALPHA® OM-565 HRL3 Solder Paste. This paste is designed to enable target reflow temperatures of 175 °C with superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HiP). The HRL3 alloy offers superior thermomechanical and drop shock performance compared to existing low temperature solutions. The ALPHA OM-565 chemistry enhances electrochemical performance over existing low temperature solders, providing excellent compatibility in contact rework applications with ALPHA tested cored wire and rework fluxes.

Recent data on ALPHA OM-565 HRL3 Solder Paste will be presented by Corné Hoppenbrouwers, Customer Technical Support Engineer, during his presentation ‘Next Generation Low Temperature Soldering Solutions’ at the SMTconnect exhibitor forum. Corné’s presentation will take place on Thursday 12th May at 13:40 in Hall 4A Booth #300.

The most recent addition to the MacDermid Alpha family of brands, Electrolube will feature their newest, eco-friendly range of bio-based conformal coatings and resins which incorporates fast-curing UV cure coating UVCLX and the UR5645 high performance PU resin. The advanced new UVCLX Coating is the first of its kind globally. UVCLX is a solvent-free, bio-based conformal coating that is completely unique to the industry and provides the highest levels of protection in a rapid processing time. The new bio-based polyurethane resin, UR5645 is a tough, two-part encapsulation system developed for the protection of electrical components in harsh environments. Both are suitable for an extremely wide range of high performance applications including automotive and EV requirements.

To register for SMTconnect click here.