Low Voiding Solutions Paper to be Presented at SMTA Juarez

Customer Technical Engineer, Francisco Gallegos, will present “Solder Void Causes and Industry Reduction Strategies” as part of the Technical Forum. Gallegos will focus on the most common causes of voids in solder joints, addressing the impact of different materials, design, equipment, and solder chemistry, and outlining the different strategies for preventing voids, including traditional solutions through stencil design and reflow profiles. The paper will also address other techniques for void mitigation, such as using solder preforms and vacuum reflow ovens.

MacDermid Alpha will also participate in the Expo, promoting both the Alpha and Kester portfolios for low voiding solutions which can increase reliability, enhance electrical and thermal performance, and eliminate costly rework. Featured solder pastes include ALPHA OM-358 and Kester NP650 and the ALPHA HiTech portfolio of adhesive, underfill, and edgebond solutions.