(Waterbury, CT USA) – December 7, 2021 – MacDermid Alpha Electronics Solutions, will exhibit its total process solutions for the emerging semiconductor market at the Semicon Taiwan, Taipei City, December 28-30, 2021 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1).
Featured will be the entire portfolio of technologies from its MacDermid Enthone, Alpha, Electrolube, Kester, and Compugraphics brands that enable the highest-end device designers and manufacturers to meet the evolving and demanding needs of the semiconductor industry. The MacDermid Enthone will be showcasing their solutions for upgraded FCCSP and PCBGA fabrication as well as their entire portfolio of solutions for building lead frame packages including PackagePrep, PackagePlate and PackageBond, the no-risk adhesion promotion system specifically engineered for reliability for today’s intense lead-free circuit assembly temperatures.
The MacDermid Enthone brand MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications and ATROX CF200-1D an electrically conductive die attach film with thermal conductivity of >20 W/m-K will be promoted. The Compugraphics brand will showcase their complete line of photomask solutions and support services.
MacDermid Alpha’s team of industry experts will be available at Hall 1 Booth I2009 to discuss advanced interconnect metallization and assembly materials as well as photomask offerings.