MacDermid Alpha Presents Sinter Technology Technical Paper at APEC Power Electronics Conference 2022

As sintered silver technology continues to replace traditional solder materials for die attach applications, the bottleneck for further inverter reliability improvement is shifting to the heat sink level. Direct cooled pin-fin modules, without baseplate and thermal grease, have been shown to have lower thermal resistance. In this paper, Gyan Dutt, Global Portfolio Manager for Power Electronics, will introduce a novel large area dispense process for silver sintering paste application that is particularly suited for transfer-molded power packages.

Dutt will define the application process steps, review the results of assembly characterization, and discuss reliability improvements by silver sintering (over solder) with commercially available SiC MOSFET modules. “Module to heat sink sintering, along with sintered die top attach, is the next frontier for further reliability and power density improvements for EV traction power modules and inverters. The system level benefits in weight savings and cooling requirements will propel the use of sintering technology throughout the power assembly stack, especially for high end EVs” comments Dutt.

The paper will be delivered on Wednesday, March 23, 2022 at 5:10 – 5:45 pm.