New Low Temperature Solder Paste to be featured at SMTA Huntsville Expo & Tech Forum

MacDermid Alpha will feature the recently launched ALPHA OM-565 HRL3 low temperature solder paste. ALPHA OM-565 HRL3 is formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages. The ALPHA OM-565 chemistry enhances thermomechanical performance over existing low temperature solders, including excellent compatibility when used in combination with other tested assembly products, such as rework fluxes and cored solder wires.

“ALPHA OM-565 HRL3 alloy is our latest low temperature solder (LTS) paste and is an important addition to our LTS portfolio of solutions offering,” said Scott Lewin, Regional Marketing Manager. “Not only does it minimize post-reflow defects such as non-wet opens and head-in-pillow, but it also provides similar thermal cycling and drop shock performance to SAC305 at its target operating temperature range of -40 up to 85 °C. All this at a peak reflow temperature of only 175 °C! Because of this lower peak temperature requirement, ALPHA OM-565 also lowers overall energy consumption contributing to the industry’s efforts at increased sustainability.”

In addition, the high reliability solutions portfolio including ALPHA CVP-390V and Kester NP505-HR solder pastes with Innolot alloy and the ALPHA HiTech series of adhesive, edgebond, and underfill will be promoted. These materials are designed for a wide range of applications to provide exceptional performance in the harshest of environments.