Presentation on Power Package Attach by Silver Sintering at PCIM Asia Conference

As silver sintering replaces solder at the die level (both for die attach and for top side attach), the bottleneck for further power cycling and overall thermal improvement is shifting to base-plate and heat sink levels. Due to the large areas involved, the higher CTE mismatch and the module´s inherent temperature dependent warpage, silver sintering at these levels brings specific process and reliability challenges. These challenges will be addressed in MacDermid Alpha’s paper presentation. As an alternative to printing, MacDermid Alpha will introduce a novel large area dispense process for silver sintering paste application that is particularly well suited for larger transfer-molded power packages. The process windows for drying and sintering will be defined, as well as their effect on joint integrity through die shear, acoustic microscopy, and thermal shock reliability testing. As well as discussing sintering paste, the paper will also demonstrate the use of novel sintering preforms that eliminate the paste application and drying steps altogether.

Wilson Wu, Application Manager – Die Attach, will be presenting the paper at 15:30pm on Tuesday, November 17th at Room 1 “Advanced Packaging Technologies” at Shanghai World Expo Exhibition and Convention Center Shanghai. 

PCIM Asia Conference 2020

• Date: November 17, 2020 (Tuesday)
• Time: 15:30 – 15:50
• Venue: Room 1, Shanghai World Expo Exhibition and Convention Center Shanghai, China
• Topic: Power Package Attach by Silver Sintering – Process, Performance & Reliability
• Speaker: Wilson Wu, Application Manager - Die Attach