Technical Presentation on Materials for 3D Structural Electronics at LOPEC 2021 Virtual Exhibition & Conference

Dr. Nirmalya Kumar Chaki, Manager, Advanced Materials Research will present the latest innovations in Electronic Inks as part of the 3D Structural Electronics Session. His presentation will focus on three main areas: 1) Trends and drivers in formable materials for In-Mold electronics (IME) applications 2) Performance of Formable Silver and Dielectric Inks and 3) 3D In-Mold Electronics Technology Demonstrators.

MacDermid Alpha has been developing a compatible suite of conductive inks and materials to meet the unique requirements and reliability standards for Flexible Hybrid Electronics (FHE) as well as In-Mold Electronics (IME). “We are pleased and excited to participate in this global forum organized by LOPEC and are looking forward to presenting MacDermid Alpha’s innovative solutions for Flexible Hybrid Electronics (FHE) and In-Mold Electronics (IME).” said Dr. Nirmalya Kumar Chaki.

LOPEC will be held from March 23 – March 25, 2021 as a virtual event. To register for the event please visit the LOPEC website.

Link here for information about our Flexible, Formable and Printed Electronics Solutions.