Ultra-Fine Feature Solder Paste Introduced at Productronica China

ALPHA OM-372 is designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components. ALPHA OM-372 is formulated to deliver low post reflow residue and superior transfer efficiency on fine feature pads as low as 80x130µm (008004). A combination of these best-in-class features as well as excellent HIP and NWO performance makes it ideal for a broad range of high board density applications requiring smaller, thinner, and lighter form factor components.

MacDermid Alpha will also be promoting its latest ALPHA HiTech bonding materials including the newly launched ALPHA HiTech Underfill and Edgebond products featuring high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. ALPHA Argomax® sintering process solutions and new technology for flexible formable and printed electronics will also be featured.

For additional information about MacDermid Alpha's latest technologies and products, please visit Booth #E4-4702 at Productronica China, or visit MacDermidAlpha.com

Productronica China 2021
Date: March 17-19, 2021
Venue: Shanghai New International Expo Centre
Booth# E4-4702