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Void Reduction & Silver Free Alloy Solutions Presented at SMTA South China Technology Conference
The Assembly Division will be presenting two technical papers; “Methods of Reducing or Eliminating Voids in BGA and BTC Devices” and “Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?” at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
Voiding is an area of concern for the long-term durability and functionality of electronic devices. Voids near or at the interface of surface mount technology (SMT) component input/outputs (I/O’s), or the circuit board substrate can be highly probable initiators of crack propagation, leading to the high possibility of a field failure. Voids are also very good insulators of heat, leading to thermal issues with heat sinks and thermal pads often used in power devices.
The paper “Methods of Reducing or Eliminating Voids in BGA and BTC Devices” will focus on discussing both laboratory and field data and is aimed at circuit assembly engineers and designers who need to minimize voiding in tin lead and lead-free assemblies.
Traditionally, hole fill requirements in types II and III assemblies had required the use of silver bearing lead-free alloys during wave soldering. As a result of continuous alloy developments, an opportunity now exists to employ a silver free lead-free alloy that can meet such hole fill requirements. The second paper, “Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?” will focus on sharing basic performance, limits, and strategic opportunities of the ALPHA® SnCX Plus 07 silver free alloy. Data is provided to help manufacturers keen on further savings to identify suitable Type II and even Type III assemblies for technical evaluations.
Link here for more information on Alpha’s void reduction solutions and the ALPHA SnCX Plus 07 silver free alloy.
SMTA South China Technology Conference
Date: 26th August 2020 – 27th August 2020
Venue: Booth 1A80, Hall 1, Shenzhen Conventional & Exhibition Center, Shenzhen, China
Presented By: William Yu, Senior Technical Services Manager, MacDermid Alpha Electronics Solutions
1st Topic: Methods of Reducing or Eliminating Voids in BGA and BTC Devices
Date: 26th August 2020 (Wednesday)
Time: 13:45-14:20
2nd Topic: Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?
Date: 27th August 2020 (Thursday)
Time: 11:15-12:30
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