Advanced interconnect metallization and assembly materials used in leading-edge chip fabrication and wafer-level packaging.
We supply leading-edge technologies that enable the highest-end device designers and manufacturers to meet the evolving and demanding needs of the semiconductor industry.
We are committed to providing the global semiconductor and microelectronics industries with a full line of innovative and high quality plating, soldering and assembly materials.
We provide applications expertise through in-depth knowledge of chemistry and processes at regional applications centers of excellence.
We provide innovative, sustainable solutions in microelectronics fabrication and packaging to semiconductor industry leaders.
We provide high quality photomask and reticle solutions based on technical and service excellence to our global customer base.
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Webinar offered on Innovative Low Temperature Solder Solutions for Defect-free Next Generation Package Designs
Access to a range of information, including sales sheets, brochures, technical papers, and safety and technical data sheets.
Supported by robust innovation and quality-obsessed manufacturing, our global, regional, and local experts deliver custom fit solutions to the entire electronics supply chain.