Package designs such as Plastic Ball Grid Array (PBGA), Flip Chip Ball Grid Array (FC-BGA), Chip Scale Packaging (CSP) and Package on Package (PoP) fall under laminate packaging applications. A wide range of technologies and materials are required to enable the creation of highly reliable laminate packages.
Laminate packaging involves key process solutions such as:
- Die attach/stacking
- Wire bonding
- Flip chip attach
- Component/passive attach
- Solder sphere attach
BGA format is superior in lowering thermal resistance, reducing inductance, and increasing the number of interconnects. Hence, laminate packages have wider applications on gate arrays, microprocessors/controllers, memory, analog, and RF devices.
MacDermid Alpha provides a comprehensive die attach portfolio for high performance applications on laminate packaging. Our die-attach paste and film products demonstrate outstanding performance in high thermal conductivity, no/low resin bleed out, minimum out-gassing, low modulus, high flexibility and low moisture absorption.